140-065: RESISTOR,FIXED,FILM.
Helps a processor keep its cool. MANHATTAN CPU Thermal Grease helps create maximum surface-to-surface conductivity between a microprocessor and the CPU cooler heat sink to reduce overheating risks. Specially formulated to reliably and easily fill manufacturing imperfections in the wafer and heat sink surfaces, MANHATTAN CPU Thermal Grease closes critical gaps that can reduce cooling effectiveness and increase possible failure.
- Increases thermal conductivity between CPU and heat sink - Helps dissipate damaging heat to prolong CPU life - Syringe dispenser with resealable cap for precise and easy application - Designed for multiple applications This part is cataloged in the U.S. Government catalog under NSN 5905-01-004-6098, indicating validated use in U.S. government and defense logistics supply chains.
| material | PLASTIC CASE |
| body_style | W/O MTG FACILITIES TERMINAL(S) ON ONE SURFACE |
| body_width | 11.0 MILLIMETERS NOMINAL MM |
| body_height | 5.0 MILLIMETERS NOMINAL MM |
| body_length | 13.0 MILLIMETERS NOMINAL MM |
| terminal_diameter | 0.7 MILLIMETERS NOMINAL MM |
| dielectric_material | PLASTIC POLYPROPYLENE |
| electrical_resistance | 47.000 OHMS |
| reliability_indicator | NOT ESTABLISHED |
| functional_description | USED TO STOP TEETER BONDING |
| end_item_identification | 6625013636212 (34280) |
| nonderated_operating_temp | -55.0 CELSIUS MINIMUM AND 100.0 CELSIUS MAXIMUM DEGC |
| NSN | 5905-01-004-6098 |
| RESISTANCE TOLERANCE IN PERCENT | -5.000 TO 5.000 |
| ELECTRICAL RESISTANCE | 47.000 OHMS |
| POWER DISSIPATION RATING IN WATTS | 0.250 FREE AIR |
No substitute or cross-reference records for this part.