1372FW1047-001 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

1372FW1047-001: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.290 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN, body_height: 0.180 INCHES MINIMUM AND 0.200 INCHES MAXIMUM IN, body_length: 1.040 INCHES MINIMUM AND 1.060 INCHES MAXIMUM IN, special_features: ESD; ALTERED ITEM USING 67268,5962-8515520RX; CHECKSUM 63DC; FILE NAME 1060 U54.JED, features_provided: BIPOLAR AND ELECTROSTATIC SENSITIVE AND MONOLITHIC AND PROGRAMMED, output_logic_form: BIPOLAR METAL-OXIDE SEMICONDUCTOR. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-372-3916, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

1372FW1047-001

NSN: 5962-01-372-3916
FSC: 5962 — Microcircuits, Electronic
CAGE: 72314 — BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC. (USA)

SPECIFICATIONS

body_width	0.290 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
body_height	0.180 INCHES MINIMUM AND 0.200 INCHES MAXIMUM IN
body_length	1.040 INCHES MINIMUM AND 1.060 INCHES MAXIMUM IN
special_features	ESD; ALTERED ITEM USING 67268,5962-8515520RX; CHECKSUM 63DC; FILE NAME 1060 U54.JED
features_provided	BIPOLAR AND ELECTROSTATIC SENSITIVE AND MONOLITHIC AND PROGRAMMED
output_logic_form	BIPOLAR METAL-OXIDE SEMICONDUCTOR
inclosure_material	CERAMIC
memory_device_type	PAL
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
end_item_identification	EO LOROPS
NSN	5962-01-372-3916

COMPONENT DIAGRAM

KEY FEATURES

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.290 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.180 INCHES MINIMUM AND 0.200 INCHES MAXIMUM IN

•

CRITICALITY CODE JUSTIFICATION: FEAT

•

FEATURES PROVIDED: BIPOLAR AND ELECTROSTATIC SENSITIVE AND MONOLITHIC AND PROGRAMMED

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

MEMORY DEVICE TYPE: PAL

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.290 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
BODY HEIGHT	0.180 INCHES MINIMUM AND 0.200 INCHES MAXIMUM IN
CRITICALITY CODE JUSTIFICATION	FEAT
FEATURES PROVIDED	BIPOLAR AND ELECTROSTATIC SENSITIVE AND MONOLITHIC AND PROGRAMMED
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	PAL
CASE OUTLINE SOURCE AND DESIGNATOR	D-8 MIL-M-38510
SPECIFICATION/STANDARD DATA	67268-5962-85155 GOVERNMENT STANDARD

OTHER ITEMS IN FSC 5962 — Microcircuits, Electronic

Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.

5962-00-001-1861 5962-00-001-1901 5962-00-001-1902 5962-00-001-1905 5962-00-001-1906 5962-00-001-1907 5962-00-001-1908 5962-00-001-1909

SUBSTITUTES & CROSS-REFERENCES

No substitute or cross-reference records for this part.

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — mutilation + specific procedure

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FREQUENTLY ASKED QUESTIONS

What is 1372FW1047-001?

1372FW1047-001 is a MICROCIRCUIT,MEMORY.

What is the NSN for 1372FW1047-001?

1372FW1047-001 is cataloged in the U.S. Government catalog under NSN 5962-01-372-3916. This indicates validated use in U.S. government and defense supply chains.

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1372FW1047-001 — MICROCIRCUIT,MEMORY

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