1369FW1023-001 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

1369FW1023-001: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN, body_height: 0.172 INCHES MINIMUM AND 0.217 INCHES MAXIMUM IN, body_length: 1.490 INCHES MAXIMUM IN, overall_height: 0.432 INCHES MAXIMUM IN, overall_length: 1.490 INCHES MAXIMUM IN, memory_capacity: UNKNOWN. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-368-6592, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

1369FW1023-001

NSN: 5962-01-368-6592
FSC: 5962 — Microcircuits, Electronic
CAGE: 72314 — BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC. (USA)

SPECIFICATIONS

body_width	0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN
body_height	0.172 INCHES MINIMUM AND 0.217 INCHES MAXIMUM IN
body_length	1.490 INCHES MAXIMUM IN
overall_height	0.432 INCHES MAXIMUM IN
overall_length	1.490 INCHES MAXIMUM IN
memory_capacity	UNKNOWN
special_features	ESD;MADE FROM PN 5962-8863401XX
features_provided	HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND PROGRAMMABLE
output_logic_form	COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	EEPROM
storage_temp_range	-65.0 TO 140.0 CELSIUS DEGC
NSN	5962-01-368-6592

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 26 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.172 INCHES MINIMUM AND 0.217 INCHES MAXIMUM IN

•

CRITICALITY CODE JUSTIFICATION: FEAT

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

OVERALL HEIGHT	0.432 INCHES MAXIMUM IN
INPUT CIRCUIT PATTERN	26 INPUT
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN
BODY HEIGHT	0.172 INCHES MINIMUM AND 0.217 INCHES MAXIMUM IN
CRITICALITY CODE JUSTIFICATION	FEAT
OVERALL LENGTH	1.490 INCHES MAXIMUM IN
FEATURES PROVIDED	HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND PROGRAMMABLE
INCLOSURE CONFIGURATION	DUAL-IN-LINE

OTHER ITEMS IN FSC 5962 — Microcircuits, Electronic

Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.

5962-00-001-1861 5962-00-001-1901 5962-00-001-1902 5962-00-001-1905 5962-00-001-1906 5962-00-001-1907 5962-00-001-1908 5962-00-001-1909

SUBSTITUTES & CROSS-REFERENCES

No substitute or cross-reference records for this part.

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — mutilation + specific procedure

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FREQUENTLY ASKED QUESTIONS

What is 1369FW1023-001?

1369FW1023-001 is a MICROCIRCUIT,MEMORY.

What is the NSN for 1369FW1023-001?

1369FW1023-001 is cataloged in the U.S. Government catalog under NSN 5962-01-368-6592. This indicates validated use in U.S. government and defense supply chains.

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1369FW1023-001 — MICROCIRCUIT,MEMORY

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