1355003: SEMICONDUCTOR DEVICE,DIODE.
The SEMICONDUCTOR DEVICE,DIODE is a the manufacturer industrial component. Key specifications include material: PLASTIC ENCLOSURE, temp_rating: -15.0 FAHRENHEIT AND 400.0 FAHRENHEIT DEGF, overall_width: 1.40 MILLIMETERS MINIMUM AND 1.70 MILLIMETERS MAXIMUM MM, overall_height: 1.00 MILLIMETERS MINIMUM AND 1.35 MILLIMETERS MAXIMUM MM, overall_length: 3.55 MILLIMETERS MINIMUM AND 3.85 MILLIMETERS MAXIMUM MM, mounting_method: TERMINAL. This part is cataloged in the U.S.
Government catalog under NSN 5310-01-084-4491, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| material | PLASTIC ENCLOSURE |
| temp_rating | -15.0 FAHRENHEIT AND 400.0 FAHRENHEIT DEGF |
| overall_width | 1.40 MILLIMETERS MINIMUM AND 1.70 MILLIMETERS MAXIMUM MM |
| overall_height | 1.00 MILLIMETERS MINIMUM AND 1.35 MILLIMETERS MAXIMUM MM |
| overall_length | 3.55 MILLIMETERS MINIMUM AND 3.85 MILLIMETERS MAXIMUM MM |
| mounting_method | TERMINAL |
| terminal_length | 0.55 MILLIMETERS NOMINAL MM |
| features_provided | ELECTROSTATIC SENSITIVE AND MOISTURE SENSITIVE AND MOUNTING PAD AND ROHS DIRECTIVE COMPLIANCE |
| center_hole_diameter | 0.111 INCHES MINIMUM AND 0.121 INCHES MAXIMUM IN |
| cross-sectional_height | 0.035 INCHES MINIMUM AND 0.041 INCHES MAXIMUM IN |
| mounting_facility_quantity | 2 |
| terminal_type_and_quantity | 2 BONDING PAD |
| NSN | 5310-01-084-4491 |