13401041-8 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

13401041-8: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.515 INCHES MINIMUM AND 0.535 INCHES MAXIMUM IN, body_height: 0.160 INCHES MINIMUM AND 0.190 INCHES MAXIMUM IN, body_length: 1.440 INCHES MINIMUM AND 1.470 INCHES MAXIMUM IN, bit_quantity: 65536, word_quantity: 8192, features_provided: W/ENABLE AND ASYNCHRONOUS AND LOW CURRENT AND HERMETICALLY SEALED. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-275-6635, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

13401041-8

NSN: 5962-01-275-6635
FSC: 5962 — Microcircuits, Electronic
CAGE: F6151 — SAFRAN (FRA)

SPECIFICATIONS

body_width	0.515 INCHES MINIMUM AND 0.535 INCHES MAXIMUM IN
body_height	0.160 INCHES MINIMUM AND 0.190 INCHES MAXIMUM IN
body_length	1.440 INCHES MINIMUM AND 1.470 INCHES MAXIMUM IN
bit_quantity	65536
word_quantity	8192
features_provided	W/ENABLE AND ASYNCHRONOUS AND LOW CURRENT AND HERMETICALLY SEALED
output_logic_form	COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	RAM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
NSN	5962-01-275-6635

COMPONENT DIAGRAM

KEY FEATURES

•

BIT QUANTITY: 65536

•

INPUT CIRCUIT PATTERN: 17 INPUT

•

WORD QUANTITY: 8192

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.515 INCHES MINIMUM AND 0.535 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.160 INCHES MINIMUM AND 0.190 INCHES MAXIMUM IN

•

FEATURES PROVIDED: W/ENABLE AND ASYNCHRONOUS AND LOW CURRENT AND HERMETICALLY SEALED

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

BIT QUANTITY	65536
INPUT CIRCUIT PATTERN	17 INPUT
WORD QUANTITY	8192
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.515 INCHES MINIMUM AND 0.535 INCHES MAXIMUM IN
BODY HEIGHT	0.160 INCHES MINIMUM AND 0.190 INCHES MAXIMUM IN
FEATURES PROVIDED	W/ENABLE AND ASYNCHRONOUS AND LOW CURRENT AND HERMETICALLY SEALED
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	RAM

SUBSTITUTES & CROSS-REFERENCES 3

HM1-65642/883Reference document

Same NSN cross-reference

Reference document — Secondary reference

EDH8808ACL15KMHRReference document

Same NSN cross-reference

Reference document — Secondary reference

16E10096Reference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Demilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is 13401041-8?

13401041-8 is a MICROCIRCUIT,MEMORY.

What parts can replace 13401041-8?

There are 3 known substitutes for 13401041-8: HM1-65642/883, EDH8808ACL15KMHR, 16E10096. Substitute compatibility should be verified for your specific system.

What is the NSN for 13401041-8?

13401041-8 is cataloged in the U.S. Government catalog under NSN 5962-01-275-6635. This indicates validated use in U.S. government and defense supply chains.

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