13214386-01 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

13214386-01: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.500 INCHES NOMINAL IN, body_height: 0.060 INCHES MINIMUM AND 0.100 INCHES MAXIMUM IN, body_length: 0.500 INCHES NOMINAL IN, features_provided: BIPOLAR AND BURN IN AND ELECTROSTATIC SENSITIVE AND 3-STATE OUTPUT AND PROGRAMMED, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-480-9541, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

13214386-01

NSN: 5962-01-480-9541
FSC: 5962 — Microcircuits, Electronic
CAGE: 3CYA2 — GENERAL DYNAMICS MISSION SYSTEMS, INC. (USA)

SPECIFICATIONS

body_width	0.500 INCHES NOMINAL IN
body_height	0.060 INCHES MINIMUM AND 0.100 INCHES MAXIMUM IN
body_length	0.500 INCHES NOMINAL IN
features_provided	BIPOLAR AND BURN IN AND ELECTROSTATIC SENSITIVE AND 3-STATE OUTPUT AND PROGRAMMED
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	ROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	14 INPUT
end_item_identification	TACTICAL AIR OPERATIONS MODULE AN/TYQ-23(V)1
inclosure_configuration	FLAT PACK
NSN	5962-01-480-9541

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 14 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.500 INCHES NOMINAL IN

•

BODY HEIGHT: 0.060 INCHES MINIMUM AND 0.100 INCHES MAXIMUM IN

•

FEATURES PROVIDED: BIPOLAR AND BURN IN AND ELECTROSTATIC SENSITIVE AND 3-STATE OUTPUT AND PROGRAMMED

•

INCLOSURE CONFIGURATION: FLAT PACK

•

MEMORY DEVICE TYPE: ROM

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	14 INPUT
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.500 INCHES NOMINAL IN
BODY HEIGHT	0.060 INCHES MINIMUM AND 0.100 INCHES MAXIMUM IN
FEATURES PROVIDED	BIPOLAR AND BURN IN AND ELECTROSTATIC SENSITIVE AND 3-STATE OUTPUT AND PROGRAMMED
INCLOSURE CONFIGURATION	FLAT PACK
MEMORY DEVICE TYPE	ROM
CASE OUTLINE SOURCE AND DESIGNATOR	C-4 MIL-M-38510
BODY LENGTH	0.500 INCHES NOMINAL IN

OTHER ITEMS IN FSC 5962 — Microcircuits, Electronic

Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.

5962-00-001-1861 5962-00-001-1901 5962-00-001-1902 5962-00-001-1905 5962-00-001-1906 5962-00-001-1907 5962-00-001-1908 5962-00-001-1909

SUBSTITUTES & CROSS-REFERENCES

No substitute or cross-reference records for this part.

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — mutilation + specific procedure

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FREQUENTLY ASKED QUESTIONS

What is 13214386-01?

13214386-01 is a MICROCIRCUIT,MEMORY.

What is the NSN for 13214386-01?

13214386-01 is cataloged in the U.S. Government catalog under NSN 5962-01-480-9541. This indicates validated use in U.S. government and defense supply chains.

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13214386-01 — MICROCIRCUIT,MEMORY

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