13206091 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

13206091: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.217 INCHES MAXIMUM IN, body_height: 0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN, body_length: 1.490 INCHES MAXIMUM IN, features_provided: ELECTROSTATIC SENSITIVE AND ASYNCHRONOUS, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-465-7723, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

13206091

NSN: 5962-01-465-7723
FSC: 5962 — Microcircuits, Electronic
CAGE: 18876 — US ARMY AVIATION AND MISSILE COMMAND (USA)

SPECIFICATIONS

body_width	0.217 INCHES MAXIMUM IN
body_height	0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN
body_length	1.490 INCHES MAXIMUM IN
features_provided	ELECTROSTATIC SENSITIVE AND ASYNCHRONOUS
output_logic_form	COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	RAM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
end_item_identification	1055-01-329-6826
inclosure_configuration	DUAL-IN-LINE
NSN	5962-01-465-7723

COMPONENT DIAGRAM

KEY FEATURES

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.217 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN

•

FEATURES PROVIDED: ELECTROSTATIC SENSITIVE AND ASYNCHRONOUS

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

MEMORY DEVICE TYPE: RAM

•

BODY LENGTH: 1.490 INCHES MAXIMUM IN

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.217 INCHES MAXIMUM IN
BODY HEIGHT	0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN
FEATURES PROVIDED	ELECTROSTATIC SENSITIVE AND ASYNCHRONOUS
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	RAM
BODY LENGTH	1.490 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC
OUTPUT LOGIC FORM	COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC

SUBSTITUTES & CROSS-REFERENCES

No substitute or cross-reference records for this part.

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandNo demilitarization required

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FREQUENTLY ASKED QUESTIONS

What is 13206091?

13206091 is a MICROCIRCUIT,MEMORY.

What is the NSN for 13206091?

13206091 is cataloged in the U.S. Government catalog under NSN 5962-01-465-7723. This indicates validated use in U.S. government and defense supply chains.

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13206091 — MICROCIRCUIT,MEMORY

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