13201331-02 — MICROCIRCUIT,DIGITAL

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

13201331-02: MICROCIRCUIT,DIGITAL.

The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM IN, body_height: 0.060 INCHES MINIMUM AND 0.100 INCHES MAXIMUM IN, body_length: 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND SCHOTTKY, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-270-1948, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

13201331-02

NSN: 5962-01-270-1948
FSC: 5962 — Microcircuits, Electronic
CAGE: 27963 — GENERAL DYNAMICS INFORMATION SYSTEMS INC. DBA GENERAL DYNAMICS ADVANCED INFORMATION SYSTEMS (USA)

SPECIFICATIONS

body_width	0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM IN
body_height	0.060 INCHES MINIMUM AND 0.100 INCHES MAXIMUM IN
body_length	0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM IN
features_provided	HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND SCHOTTKY
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	QUAD 2 INPUT
inclosure_configuration	LEADLESS FLAT PACK
terminal_surface_treatment	SOLDER
terminal_type_and_quantity	20 LEADLESS
NSN	5962-01-270-1948

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: QUAD 2 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

DESIGN FUNCTION AND QUANTITY: 4 GATE, NAND

•

BODY WIDTH: 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.060 INCHES MINIMUM AND 0.100 INCHES MAXIMUM IN

•

FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND SCHOTTKY

•

INCLOSURE CONFIGURATION: LEADLESS FLAT PACK

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	QUAD 2 INPUT
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
DESIGN FUNCTION AND QUANTITY	4 GATE, NAND
BODY WIDTH	0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM IN
BODY HEIGHT	0.060 INCHES MINIMUM AND 0.100 INCHES MAXIMUM IN
FEATURES PROVIDED	HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND SCHOTTKY
INCLOSURE CONFIGURATION	LEADLESS FLAT PACK
CASE OUTLINE SOURCE AND DESIGNATOR	C-2 MIL-M-38510
SPECIFICATION/STANDARD DATA	81349-MIL-M-38510/330 GOVERNMENT SPECIFICATION

SUBSTITUTES & CROSS-REFERENCES 9

10136425Reference document

Same NSN cross-reference

Reference document — Informative reference only

54F00L1MQBReference document

Same NSN cross-reference

Reference document — Advisory reference — outside the item-of-supply concept

M38510/33001B2XReference document

Same NSN cross-reference

Reference document — Secondary reference

M38510/33001B2BReference document

Same NSN cross-reference

Reference document — Secondary reference

5003684Reference document

Same NSN cross-reference

Reference document — Replaced / superseded reference

M38510/33001B2ASame NSN cross-reference

Same NSN cross-reference

Also cataloged under this NSN

LIFECYCLE

NSN statusCancelled· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is 13201331-02?

13201331-02 is a MICROCIRCUIT,DIGITAL.

What parts can replace 13201331-02?

There are 9 known substitutes for 13201331-02: 10136425, 54F00L1MQB, M38510/33001B2X and 6 more. Substitute compatibility should be verified for your specific system.

What is the NSN for 13201331-02?

13201331-02 is cataloged in the U.S. Government catalog under NSN 5962-01-270-1948. This indicates validated use in U.S. government and defense supply chains.

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