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13058970 — MICROCIRCUIT,DIGITAL

✓ Government record, cited
— · MRO · MRO_GENERAL
PRODUCT OVERVIEW

13058970: MICROCIRCUIT,DIGITAL.

The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.576 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN, body_height: 0.160 INCHES MAXIMUM IN, body_length: 1.980 INCHES MINIMUM AND 2.020 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND BIDIRECTIONAL AND STATIC OPERATION AND W/RESET AND PROGRAMMABLE, output_logic_form: N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-192-1767, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
MRO→ MRO_GENERAL→ 13058970
NSN: 5962-01-192-1767
NIINs: 011921767, 016607596
FSC: 5962 — Microcircuits, Electronic
CAGE: 18876 — US ARMY AVIATION AND MISSILE COMMAND (USA)
SPECIFICATIONS
body_width0.576 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN
body_height0.160 INCHES MAXIMUM IN
body_length1.980 INCHES MINIMUM AND 2.020 INCHES MAXIMUM IN
features_providedHERMETICALLY SEALED AND BIDIRECTIONAL AND STATIC OPERATION AND W/RESET AND PROGRAMMABLE
output_logic_formN-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_materialCERAMIC
storage_temp_range-55.0 TO 150.0 CELSIUS DEGC
operating_temp_range+0.0 TO 70.0 CELSIUS DEGC
input_circuit_pattern36 INPUT
end_item_identification4935-00-930-7250 TEST STATION,GU
inclosure_configurationDUAL-IN-LINE
terminal_surface_treatmentSOLDER
NSN5962-01-192-1767
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,DIGITAL TITLE COMPONENT PN 13058970 MFR MICROCIRCUIT,DIGITAL
KEY FEATURES
•
INPUT CIRCUIT PATTERN: 36 INPUT
•
INCLOSURE MATERIAL: CERAMIC
•
TERMINAL SURFACE TREATMENT: SOLDER
•
DESIGN FUNCTION AND QUANTITY: 1 PERIPHERAL, INTERFACE
•
BODY WIDTH: 0.576 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN
•
BODY HEIGHT: 0.160 INCHES MAXIMUM IN
•
FEATURES PROVIDED: HERMETICALLY SEALED AND BIDIRECTIONAL AND STATIC OPERATION AND W/RESET AND PROGRAMMABLE
•
INCLOSURE CONFIGURATION: DUAL-IN-LINE
TECHNICAL CHARACTERISTICS
INPUT CIRCUIT PATTERN36 INPUT
INCLOSURE MATERIALCERAMIC
TERMINAL SURFACE TREATMENTSOLDER
DESIGN FUNCTION AND QUANTITY1 PERIPHERAL, INTERFACE
BODY WIDTH0.576 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN
BODY HEIGHT0.160 INCHES MAXIMUM IN
FEATURES PROVIDEDHERMETICALLY SEALED AND BIDIRECTIONAL AND STATIC OPERATION AND W/RESET AND PROGRAMMABLE
INCLOSURE CONFIGURATIONDUAL-IN-LINE
BODY LENGTH1.980 INCHES MINIMUM AND 2.020 INCHES MAXIMUM IN
STORAGE TEMP RANGE-55.0 TO 150.0 CELSIUS DEGC
SUBSTITUTES & CROSS-REFERENCES 10
MC68B21CLReference document
Same NSN cross-reference
Reference document — Replaced / superseded reference
EF68B21CReference document
Same NSN cross-reference
Reference document — Secondary reference
MC68B21LReference document
Same NSN cross-reference
Reference document — Secondary reference
MC68B21CSReference document
Same NSN cross-reference
Reference document — Advisory reference — outside the item-of-supply concept
900656-2Reference document
Same NSN cross-reference
Reference document — Replaced / superseded reference
S6821CReference document
Same NSN cross-reference
Reference document — Secondary reference
LIFECYCLE
NSN statusCancelled· U.S. Government catalog
Acquisition advice: Terminal item — no further procurement; issued until stock is exhaustedNo demilitarization required
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FREQUENTLY ASKED QUESTIONS
What is 13058970?
13058970 is a MICROCIRCUIT,DIGITAL. It is classified as a MRO (MRO_GENERAL).
What parts can replace 13058970?
There are 10 known substitutes for 13058970: MC68B21CL, EF68B21C, MC68B21L and 7 more. Substitute compatibility should be verified for your specific system.
What is the NSN for 13058970?
13058970 is cataloged in the U.S. Government catalog under NSN 5962-01-192-1767. This indicates validated use in U.S. government and defense supply chains.
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