13048959: CIRCUIT CARD ASSEMBLY.
The CIRCUIT CARD ASSEMBLY is a the manufacturer industrial component. Key specifications include temp_rating: -60.0 CELSIUS AND 200.0 CELSIUS DEGC, surface_treatment: ZINC OVERALL, end_item_identification: LW 155 HOWITZER, part_name_assigned_by_controlling_agency: SEAL BONDED. This part is cataloged in the U.S.
Government catalog under NSN 5998-01-177-2478, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| temp_rating | -60.0 CELSIUS AND 200.0 CELSIUS DEGC |
| surface_treatment | ZINC OVERALL |
| functional_description | TO SEAL THREADED CONNECTION AGAINST HIGH AND LOW PRESSURE LEAKAGE, WHILST THE METALLIC ANNULUS PREVENTS OVER COMPRESSION AND EXTRUSION OF THE ELASTORMERIC SEAL. |
| end_item_identification | LW 155 HOWITZER |
| part_name_assigned_by_controlling_agency | SEAL BONDED |
| NSN | 5998-01-177-2478 |
| SPECIAL FEATURES | CAPACITOR 3,PRINTED WIRING BOARD 1,RESISTOR 2 |
No substitute or cross-reference records for this part.