13032399 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

13032399: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.245 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN, body_height: 0.140 INCHES MINIMUM AND 0.175 INCHES MAXIMUM IN, body_length: 1.430 INCHES MINIMUM AND 1.485 INCHES MAXIMUM IN, bit_quantity: 18432, word_quantity: 2048, overall_height: 0.280 INCHES MINIMUM AND 0.400 INCHES MAXIMUM IN. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-349-5493, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

13032399

NSN: 5962-01-349-5493
FSC: 5962 — Microcircuits, Electronic
CAGE: 18876 — US ARMY AVIATION AND MISSILE COMMAND (USA)

SPECIFICATIONS

body_width	0.245 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
body_height	0.140 INCHES MINIMUM AND 0.175 INCHES MAXIMUM IN
body_length	1.430 INCHES MINIMUM AND 1.485 INCHES MAXIMUM IN
bit_quantity	18432
word_quantity	2048
overall_height	0.280 INCHES MINIMUM AND 0.400 INCHES MAXIMUM IN
overall_length	1.430 INCHES MINIMUM AND 1.485 INCHES MAXIMUM IN
features_provided	W/CLOCK AND W/RESET AND MONOLITHIC
output_logic_form	COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	FIRST-IN FIRST-OUT
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
NSN	5962-01-349-5493

COMPONENT DIAGRAM

KEY FEATURES

•

BIT QUANTITY: 18432

•

INPUT CIRCUIT PATTERN: 15 INPUT

•

WORD QUANTITY: 2048

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.245 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.140 INCHES MINIMUM AND 0.175 INCHES MAXIMUM IN

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

BIT QUANTITY	18432
OVERALL HEIGHT	0.280 INCHES MINIMUM AND 0.400 INCHES MAXIMUM IN
INPUT CIRCUIT PATTERN	15 INPUT
WORD QUANTITY	2048
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.245 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
BODY HEIGHT	0.140 INCHES MINIMUM AND 0.175 INCHES MAXIMUM IN
CAPITANCE RATING PER CHARACTERISTIC	8.00 INPUT PICOFARADS MAXIMUM AND 12.00 OUTPUT PICOFARADS MAXIMUM
OVERALL LENGTH	1.430 INCHES MINIMUM AND 1.485 INCHES MAXIMUM IN

SUBSTITUTES & CROSS-REFERENCES 5

5962-8866902YXReference document

Same NSN cross-reference

Reference document — Secondary reference

5962-8866902YASame NSN cross-reference

Same NSN cross-reference

Also cataloged under this NSN

5962-88669Reference document

Same NSN cross-reference

Reference document — Identification reference

CY7C429-65DMBReference document

Same NSN cross-reference

Reference document — Secondary reference

5962-8866902YBReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — mutilation + specific procedure

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FREQUENTLY ASKED QUESTIONS

What is 13032399?

13032399 is a MICROCIRCUIT,MEMORY.

What parts can replace 13032399?

There are 5 known substitutes for 13032399: 5962-8866902YX, 5962-8866902YA, 5962-88669 and 2 more. Substitute compatibility should be verified for your specific system.

What is the NSN for 13032399?

13032399 is cataloged in the U.S. Government catalog under NSN 5962-01-349-5493. This indicates validated use in U.S. government and defense supply chains.

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13032399 — MICROCIRCUIT,MEMORY

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