The SEMICONDUCTOR DEVICE,DIODE is a the manufacturer industrial component. Key specifications include material: GLASS ENCLOSURE, overall_length: 0.375 INCHES NOMINAL IN, mounting_method: TERMINAL, terminal_length: 1.000 INCHES MINIMUM IN, overall_diameter: 0.200 INCHES NOMINAL IN, features_provided: HERMETICALLY SEALED CASE. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5999-00-315-3454, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| material | GLASS ENCLOSURE |
| overall_length | 0.375 INCHES NOMINAL IN |
| mounting_method | TERMINAL |
| terminal_length | 1.000 INCHES MINIMUM IN |
| overall_diameter | 0.200 INCHES NOMINAL IN |
| features_provided | HERMETICALLY SEALED CASE |
| terminal_type_and_quantity | 2 UNINSULATED WIRE LEAD |
| specification/standard_data | 80131-RELEASE2310 PROFESSIONAL/INDUSTRIAL ASSOCIATION SPECIFICATION |
| current_rating_per_characteristic | 0.75 AMPERES MAXIMUM AVERAGE FORWARD CURRENT AVERAGED OVER A FULL 60-HZ CYCLE |
| voltage_rating_in_volts_per_characteristic | 200.0 MAXIMUM REVERSE VOLTAGE, PEAK |
| maximum_operating_temp_per_measurement_point | 100.0 CELSIUS AMBIENT AIR DEGC |
| NSN | 5999-00-315-3454 |
| SPECIAL FEATURES | ALUMINUM ALLOY 5052-H32; BLACK ANODIZED FINISH; 2.859 IN. LG MAX; 2.281 IN. W; 0.750 IN. H; EIGHT 0.246 IN. DIA THRU HOLES IRREGULARLY SPACED; EIGHT 0.187 IN. DIA THRU HOLES IRREGULARLY SPACED; FOUR 0.112 IN. DIA THD MTG HOLES IN |
| SPECIAL FEATURES | ALUMINUM ALLOY 5052-H32; BLACK ANODIZED FINISH; 2.859 IN. LG MAX; 2.281 IN. W; 0.750 IN. H; EIGHT 0.246 IN. DIA THRU HOLES IRREGULARLY SPACED; EIGHT 0.187 IN. DIA THRU HOLES IRREGULARLY SPACED; FOUR 0.112 IN. DIA THD MTG HOLES IN |