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12918427 — MICROCIRCUIT,MEMORY

✓ Government record, cited
— · COMPONENT
PRODUCT OVERVIEW

12918427: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN, body_height: 0.172 INCHES MINIMUM AND 0.217 INCHES MAXIMUM IN, body_length: 1.490 INCHES MAXIMUM IN, memory_capacity: UNKNOWN, features_provided: ELECTROSTATIC SENSITIVE, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-306-5562, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
12918427
NSN: 5962-01-306-5562
NIINs: 013065562, 014173254
FSC: 5962 — Microcircuits, Electronic
CAGE: 19200 — COMBAT CAPABILITIES DEVELOPMENT COMMAND (CCDC) ARMAMENTS CENTER DBA CCDC DIV LOGISTICS RESEARCH AND ENGINEERING DIRECTORATE (USA)
SPECIFICATIONS
body_width0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN
body_height0.172 INCHES MINIMUM AND 0.217 INCHES MAXIMUM IN
body_length1.490 INCHES MAXIMUM IN
memory_capacityUNKNOWN
features_providedELECTROSTATIC SENSITIVE
output_logic_formCOMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_materialCERAMIC
memory_device_typeEEPROM
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
test_data_document96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern26 INPUT
NSN5962-01-306-5562
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN 12918427 MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
INPUT CIRCUIT PATTERN: 26 INPUT
•
INCLOSURE MATERIAL: CERAMIC
•
TERMINAL SURFACE TREATMENT: SOLDER
•
BODY WIDTH: 0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN
•
BODY HEIGHT: 0.172 INCHES MINIMUM AND 0.217 INCHES MAXIMUM IN
•
FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND ERASABLE
•
INCLOSURE CONFIGURATION: DUAL-IN-LINE
•
CURRENT RATING PER CHARACTERISTIC: 80.00 MILLIAMPERES NOMINAL TOTAL SUPPLY
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS
INPUT CIRCUIT PATTERN26 INPUT
INCLOSURE MATERIALCERAMIC
TERMINAL SURFACE TREATMENTSOLDER
BODY WIDTH0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN
BODY HEIGHT0.172 INCHES MINIMUM AND 0.217 INCHES MAXIMUM IN
FEATURES PROVIDEDHERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND ERASABLE
INCLOSURE CONFIGURATIONDUAL-IN-LINE
CURRENT RATING PER CHARACTERISTIC80.00 MILLIAMPERES NOMINAL TOTAL SUPPLY
MEMORY DEVICE TYPEEEPROM
CASE OUTLINE SOURCE AND DESIGNATORD-10 MIL-M-38510
SUBSTITUTES & CROSS-REFERENCES 8
10133848Reference document
Same NSN cross-reference
Reference document — Informative reference only
X28C256DMB-25Reference document
Same NSN cross-reference
Reference document — Secondary reference
ROM/PROMReference document
Same NSN cross-reference
Reference document — Secondary reference
5962-8852503XXReference document
Same NSN cross-reference
Reference document — Secondary reference
8502736-417Reference document
Same NSN cross-reference
Reference document — Secondary reference
8764902XXReference document
Same NSN cross-reference
Reference document — Advisory reference — outside the item-of-supply concept
LIFECYCLE
NSN statusCancelled· U.S. Government catalog
Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)
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FREQUENTLY ASKED QUESTIONS
What is 12918427?
12918427 is a MICROCIRCUIT,MEMORY.
What parts can replace 12918427?
There are 8 known substitutes for 12918427: 10133848, X28C256DMB-25, ROM/PROM and 5 more. Substitute compatibility should be verified for your specific system.
What is the NSN for 12918427?
12918427 is cataloged in the U.S. Government catalog under NSN 5962-01-306-5562. This indicates validated use in U.S. government and defense supply chains.
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