128SAV61834-29 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

128SAV61834-29: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.515 INCHES MINIMUM AND 0.600 INCHES MAXIMUM IN, body_height: 0.217 INCHES MAXIMUM IN, body_length: 1.285 INCHES MAXIMUM IN, bit_quantity: 16384, word_quantity: 2048, overall_height: 0.357 INCHES NOMINAL IN. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-341-0372, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

128SAV61834-29

NSN: 5962-01-341-0372
FSC: 5962 — Microcircuits, Electronic
CAGE: 79RG9 — NORTHROP GRUMMAN SYSTEMS CORPORATION (USA)

SPECIFICATIONS

body_width	0.515 INCHES MINIMUM AND 0.600 INCHES MAXIMUM IN
body_height	0.217 INCHES MAXIMUM IN
body_length	1.285 INCHES MAXIMUM IN
bit_quantity	16384
word_quantity	2048
overall_height	0.357 INCHES NOMINAL IN
features_provided	HERMETICALLY SEALED AND BURN IN AND ULTRAVIOLET ERASABLE AND PROGRAMMABLE
output_logic_form	N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	EPROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
NSN	5962-01-341-0372

COMPONENT DIAGRAM

KEY FEATURES

•

BIT QUANTITY: 16384

•

INPUT CIRCUIT PATTERN: 13 INPUT

•

WORD QUANTITY: 2048

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.515 INCHES MINIMUM AND 0.600 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.217 INCHES MAXIMUM IN

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

BIT QUANTITY	16384
OVERALL HEIGHT	0.357 INCHES NOMINAL IN
INPUT CIRCUIT PATTERN	13 INPUT
WORD QUANTITY	2048
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.515 INCHES MINIMUM AND 0.600 INCHES MAXIMUM IN
BODY HEIGHT	0.217 INCHES MAXIMUM IN
FEATURES PROVIDED	HERMETICALLY SEALED AND BURN IN AND ULTRAVIOLET ERASABLE AND PROGRAMMABLE
INCLOSURE CONFIGURATION	DUAL-IN-LINE

SUBSTITUTES & CROSS-REFERENCES 3

ROM/PROMReference document

Same NSN cross-reference

Reference document — Secondary reference

GM820AUF1RN1Reference document

Same NSN cross-reference

Reference document — Secondary reference

MD2716M/BReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — mutilation + specific procedure

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FREQUENTLY ASKED QUESTIONS

What is 128SAV61834-29?

128SAV61834-29 is a MICROCIRCUIT,MEMORY.

What parts can replace 128SAV61834-29?

There are 3 known substitutes for 128SAV61834-29: ROM/PROM, GM820AUF1RN1, MD2716M/B. Substitute compatibility should be verified for your specific system.

What is the NSN for 128SAV61834-29?

128SAV61834-29 is cataloged in the U.S. Government catalog under NSN 5962-01-341-0372. This indicates validated use in U.S. government and defense supply chains.

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