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128EDCC00758-1 — MICROCIRCUIT,MEMORY

✓ Government record, cited
— · COMPONENT
PRODUCT OVERVIEW

128EDCC00758-1: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.610 INCHES MAXIMUM IN, body_height: 0.217 INCHES MAXIMUM IN, body_length: 1.490 INCHES MAXIMUM IN, overall_width: 0.620 INCHES MAXIMUM IN, overall_height: 0.432 INCHES MAXIMUM IN, overall_length: 1.490 INCHES MAXIMUM IN. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-321-9013, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
128EDCC00758-1
NSN: 5962-01-321-9013
FSC: 5962 — Microcircuits, Electronic
CAGE: 79RG9 — NORTHROP GRUMMAN SYSTEMS CORPORATION (USA)
SPECIFICATIONS
body_width0.610 INCHES MAXIMUM IN
body_height0.217 INCHES MAXIMUM IN
body_length1.490 INCHES MAXIMUM IN
overall_width0.620 INCHES MAXIMUM IN
overall_height0.432 INCHES MAXIMUM IN
overall_length1.490 INCHES MAXIMUM IN
features_providedBURN IN AND ELECTROSTATIC SENSITIVE AND PROGRAMMED AND ULTRAVIOLET ERASABLE
output_logic_formN-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_materialCERAMIC
memory_device_typeROM
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
test_data_document96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
NSN5962-01-321-9013
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN 128EDCC00758-1 MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
INPUT CIRCUIT PATTERN: 16 INPUT
•
INCLOSURE MATERIAL: CERAMIC
•
TERMINAL SURFACE TREATMENT: SOLDER
•
BODY WIDTH: 0.610 INCHES MAXIMUM IN
•
BODY HEIGHT: 0.217 INCHES MAXIMUM IN
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS
OVERALL HEIGHT0.432 INCHES MAXIMUM IN
INPUT CIRCUIT PATTERN16 INPUT
INCLOSURE MATERIALCERAMIC
TERMINAL SURFACE TREATMENTSOLDER
BODY WIDTH0.610 INCHES MAXIMUM IN
BODY HEIGHT0.217 INCHES MAXIMUM IN
OVERALL LENGTH1.490 INCHES MAXIMUM IN
OVERALL WIDTH0.620 INCHES MAXIMUM IN
FEATURES PROVIDEDBURN IN AND ELECTROSTATIC SENSITIVE AND PROGRAMMED AND ULTRAVIOLET ERASABLE
INCLOSURE CONFIGURATIONDUAL-IN-LINE
OTHER ITEMS IN FSC 5962 — Microcircuits, Electronic
Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.
5962-00-001-1861 5962-00-001-1901 5962-00-001-1902 5962-00-001-1905 5962-00-001-1906 5962-00-001-1907 5962-00-001-1908 5962-00-001-1909
SUBSTITUTES & CROSS-REFERENCES 2
ROM/PROMReference document
Same NSN cross-reference
Reference document — Secondary reference
8202503YAReference document
Same NSN cross-reference
Reference document — Secondary reference
LIFECYCLE
NSN statusActive· U.S. Government catalog
Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — mutilation + specific procedure
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FREQUENTLY ASKED QUESTIONS
What is 128EDCC00758-1?
128EDCC00758-1 is a MICROCIRCUIT,MEMORY.
What parts can replace 128EDCC00758-1?
There are 2 known substitutes for 128EDCC00758-1: ROM/PROM, 8202503YA. Substitute compatibility should be verified for your specific system.
What is the NSN for 128EDCC00758-1?
128EDCC00758-1 is cataloged in the U.S. Government catalog under NSN 5962-01-321-9013. This indicates validated use in U.S. government and defense supply chains.
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