The SEMICONDUCTOR DEVICE ASSEMBLY is a the manufacturer industrial component. Key specifications include material: COPPER ALLOY OVERALL, food_type: POWDERED, thickness: 0.375 INCHES NOMINAL ALL WINDINGS IN, corner_shape: SQUARE LEFT FLANGE OUTSIDE RIGHT CORNER, flange_width: 0.0230 INCHES NOMINAL IN, specific_use: DIETETIC. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5961-01-434-6706, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| material | COPPER ALLOY OVERALL |
| food_type | POWDERED |
| thickness | 0.375 INCHES NOMINAL ALL WINDINGS IN |
| corner_shape | SQUARE LEFT FLANGE OUTSIDE RIGHT CORNER |
| flange_width | 0.0230 INCHES NOMINAL IN |
| specific_use | DIETETIC |
| outside_width | 1.719 INCHES NOMINAL ALL WINDINGS IN |
| outside_length | 3.938 INCHES NOMINAL ALL WINDINGS IN |
| overall_length | 0.1094 INCHES NOMINAL IN |
| curvature_radius | 1.938 INCHES NOMINAL ALL WINDINGS IN |
| special_features | VANILLA FLAVORED; REPARED WITH WATER |
| style_designator | SOLID, EXTERNAL FLANGE ONE END |
| NSN | 5961-01-434-6706 |