The TRANSISTOR is a the manufacturer industrial component. Key specifications include overall_length: 0.210 INCHES MAXIMUM IN, transfer_ratio: 200.0 MAXIMUM STATIC FORWARD CURRENT TRANSFER RATIO, COMMON-EMITTER, mounting_method: TERMINAL, terminal_length: 0.500 INCHES MINIMUM IN, overall_diameter: 0.230 INCHES MAXIMUM IN, special_features: JUNCTION PATTERN ARRANGEMENT: NPN. This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5961-01-197-2007, indicating validated use in U.S.
government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels. Verify compatibility with your specific system configuration before ordering.
| overall_length | 0.210 INCHES MAXIMUM IN |
| transfer_ratio | 200.0 MAXIMUM STATIC FORWARD CURRENT TRANSFER RATIO, COMMON-EMITTER |
| mounting_method | TERMINAL |
| terminal_length | 0.500 INCHES MINIMUM IN |
| overall_diameter | 0.230 INCHES MAXIMUM IN |
| special_features | JUNCTION PATTERN ARRANGEMENT: NPN |
| features_provided | HERMETICALLY SEALED CASE |
| internal_configuration | JUNCTION CONTACT |
| semiconductor_material | SILICON |
| terminal_circle_diameter | 0.100 INCHES NOMINAL IN |
| terminal_type_and_quantity | 4 UNINSULATED WIRE LEAD |
| power_rating_per_characteristic | 0.2 WATTS MAXIMUM TOTAL DEVICE DISSIPATION |
| NSN | 5961-01-197-2007 |
| SPECIAL FEATURES | JUNCTION PATTERN ARRANGEMENT: NPN |
| VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 15.0 MAXIMUM COLLECTOR TO EMITTER VOLTAGE/STATIC/BASE OPEN AND 25.0 MAXIMUM COLLECTOR TO BASE VOLTAGE/STATIC/EMITTER OPEN AND 3.0 MAXIMUM EMITTER TO BASE VOLTAGE, STATIC, COLLECTOR OPEN |
| MOUNTING METHOD | TERMINAL |
| OVERALL DIAMETER | 0.230 INCHES MAXIMUM IN |
| TERMINAL CIRCLE DIAMETER | 0.100 INCHES NOMINAL IN |
| TRANSFER RATIO | 200.0 MAXIMUM STATIC FORWARD CURRENT TRANSFER RATIO, COMMON-EMITTER |
| CURRENT RATING PER CHARACTERISTIC | 30.00 MILLIAMPERES MAXIMUM COLLECTOR CURRENT, DC |
| POWER RATING PER CHARACTERISTIC | 0.2 WATTS MAXIMUM TOTAL DEVICE DISSIPATION |
| SEMICONDUCTOR MATERIAL | SILICON |
| INTERNAL CONFIGURATION | JUNCTION CONTACT |