123A882-8: MICROCIRCUIT,MEMORY.
The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include special_features: NUCLEAR HARDNESS CRITICAL ITEM, features_provided: BIPOLAR AND PROGRAMMED AND RADIATION HARDENED, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC, memory_device_type: PAL, storage_temp_range: -65.0 TO 150.0 CELSIUS DEGC. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-374-2035, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| special_features | NUCLEAR HARDNESS CRITICAL ITEM |
| features_provided | BIPOLAR AND PROGRAMMED AND RADIATION HARDENED |
| output_logic_form | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| inclosure_material | CERAMIC |
| memory_device_type | PAL |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | 16 INPUT |
| hybrid_technology_type | MONOLITHIC |
| end_item_identification | VALVE-SELECTI E/I FSCM 70339 |
| inclosure_configuration | FLAT PACK |
| terminal_surface_treatment | SOLDER |
| NSN | 5962-01-374-2035 |
| HYBRID TECHNOLOGY TYPE | MONOLITHIC |
| INPUT CIRCUIT PATTERN | 16 INPUT |
| INCLOSURE MATERIAL | CERAMIC |
| TERMINAL SURFACE TREATMENT | SOLDER |
| CRITICALITY CODE JUSTIFICATION | FEAT |
| FEATURES PROVIDED | BIPOLAR AND PROGRAMMED AND RADIATION HARDENED |
| INCLOSURE CONFIGURATION | FLAT PACK |
| CURRENT RATING PER CHARACTERISTIC | -2.00 MILLIAMPERES NOMINAL ABSOLUTE HIGH OUTPUT AND 12.00 MILLIAMPERES NOMINAL ABSOLUTE LOW OUTPUT |
| MEMORY DEVICE TYPE | PAL |
| DEPARTURE FROM CITED DESIGNATOR | ALTERED BY PROGRAMMING,TESTING & MARKING |