1219256-210 — Technical Data Sheet

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— · COMPONENT

WHAT YOU NEED TO KNOW

Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel

Confirm exact part number — similar PNs may be different parts

PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN, body_height: 0.185 INCHES MAXIMUM IN, body_length: 1.060 INCHES MAXIMUM IN, features_provided: ELECTROSTATIC SENSITIVE AND PROGRAMMABLE AND BIPOLAR AND MONOLITHIC AND HIGH IMPEDANCE AND W/CLOCK, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-370-0397, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

1219256-210

NSN: 5962-01-370-0397
FSC: 5962
CAGE: 03538 — LOCKHEED MARTIN CORPORATION DIV RMS (USA)

SPECIFICATIONS

body_width	0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
body_height	0.185 INCHES MAXIMUM IN
body_length	1.060 INCHES MAXIMUM IN
features_provided	ELECTROSTATIC SENSITIVE AND PROGRAMMABLE AND BIPOLAR AND MONOLITHIC AND HIGH IMPEDANCE AND W/CLOCK
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	PAL
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	13 INPUT
inclosure_configuration	DUAL-IN-LINE
NSN	5962-01-370-0397

COMPONENT DIAGRAM

KEY FEATURES

•

VOLTAGE RATING AND TYPE PER CHARACTERISTIC: -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE

•

BODY LENGTH: 1.060 INCHES MAXIMUM IN

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

INCLOSURE MATERIAL: CERAMIC

•

STORAGE TEMP RANGE: -65.0 TO 150.0 CELSIUS DEGC

•

MAXIMUM POWER DISSIPATION RATING: 300.0 MILLIWATTS

•

OUTPUT LOGIC FORM: TRANSISTOR-TRANSISTOR LOGIC

•

BODY HEIGHT: 0.185 INCHES MAXIMUM IN

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS (FLIS)

VOLTAGE RATING AND TYPE PER CHARACTERISTIC	-0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE
BODY LENGTH	1.060 INCHES MAXIMUM IN
INCLOSURE CONFIGURATION	DUAL-IN-LINE
INCLOSURE MATERIAL	CERAMIC
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC
MAXIMUM POWER DISSIPATION RATING	300.0 MILLIWATTS
OUTPUT LOGIC FORM	TRANSISTOR-TRANSISTOR LOGIC
BODY HEIGHT	0.185 INCHES MAXIMUM IN
PART NAME ASSIGNED BY CONTROLLING AGENCY	REGISTERED AND-OR GATE ARRAY
TEST DATA DOCUMENT	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).

VERIFIED SUBSTITUTES & CROSS-REFERENCES 15

8506502RAInterchangeable