1219253-209 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

1219253-209: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include features_provided: PROGRAMMED AND SCHOTTKY, output_logic_form: BIPOLAR METAL-OXIDE SEMICONDUCTOR, inclosure_material: CERAMIC, memory_device_type: PROM, storage_temp_range: -65.0 TO 150.0 CELSIUS DEGC, operating_temp_range: -55.0 TO 125.0 CELSIUS DEGC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-369-6840, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

1219253-209

NSN: 5962-01-369-6840
FSC: 5962 — Microcircuits, Electronic
CAGE: 03538 — LOCKHEED MARTIN CORPORATION DIV RMS (USA)

SPECIFICATIONS

features_provided	PROGRAMMED AND SCHOTTKY
output_logic_form	BIPOLAR METAL-OXIDE SEMICONDUCTOR
inclosure_material	CERAMIC
memory_device_type	PROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
hybrid_technology_type	MONOLITHIC
end_item_identification	AN/FPS-124
inclosure_configuration	DUAL-IN-LINE
terminal_surface_treatment	SOLDER
nondefinitive_spec/std_data	02 TYPE AND J CASE AND A FINISH AND 209 NUMBER
specification/standard_data	67268-82009 GOVERNMENT STANDARD AND 56232-1219253 MANUFACTURERS SPECIFICATION CONTROL
NSN	5962-01-369-6840

COMPONENT DIAGRAM

KEY FEATURES

•

HYBRID TECHNOLOGY TYPE: MONOLITHIC

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

FEATURES PROVIDED: PROGRAMMED AND SCHOTTKY

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

CURRENT RATING PER CHARACTERISTIC: 100.00 MILLIAMPERES MAXIMUM OUTPUT SINK

•

MEMORY DEVICE TYPE: PROM

•

DEPARTURE FROM CITED DESIGNATOR: ALTERED BY PROGRAMMING,MARKING & TESTING

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

HYBRID TECHNOLOGY TYPE	MONOLITHIC
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
FEATURES PROVIDED	PROGRAMMED AND SCHOTTKY
INCLOSURE CONFIGURATION	DUAL-IN-LINE
CURRENT RATING PER CHARACTERISTIC	100.00 MILLIAMPERES MAXIMUM OUTPUT SINK
MEMORY DEVICE TYPE	PROM
DEPARTURE FROM CITED DESIGNATOR	ALTERED BY PROGRAMMING,MARKING & TESTING
CASE OUTLINE SOURCE AND DESIGNATOR	D-3 MIL-M-38510
SPECIFICATION/STANDARD DATA	67268-82009 GOVERNMENT STANDARD AND 56232-1219253 MANUFACTURERS SPECIFICATION CONTROL

OTHER ITEMS IN FSC 5962 — Microcircuits, Electronic

Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.

5962-00-001-1861 5962-00-001-1901 5962-00-001-1902 5962-00-001-1905 5962-00-001-1906 5962-00-001-1907 5962-00-001-1908 5962-00-001-1909

SUBSTITUTES & CROSS-REFERENCES 2

ROM/PROMReference document

Same NSN cross-reference

Reference document — Secondary reference

8200902JAReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is 1219253-209?

1219253-209 is a MICROCIRCUIT,MEMORY.

What parts can replace 1219253-209?

There are 2 known substitutes for 1219253-209: ROM/PROM, 8200902JA. Substitute compatibility should be verified for your specific system.

What is the NSN for 1219253-209?

1219253-209 is cataloged in the U.S. Government catalog under NSN 5962-01-369-6840. This indicates validated use in U.S. government and defense supply chains.

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