1219251-209 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

1219251-209: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include features_provided: PROGRAMMED, output_logic_form: BIPOLAR METAL-OXIDE SEMICONDUCTOR, inclosure_material: CERAMIC, memory_device_type: PROM, storage_temp_range: -65.0 TO 150.0 CELSIUS DEGC, operating_temp_range: -55.0 TO 125.0 CELSIUS DEGC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-369-9244, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

1219251-209

NSN: 5962-01-369-9244
FSC: 5962 — Microcircuits, Electronic
CAGE: 03538 — LOCKHEED MARTIN CORPORATION DIV RMS (USA)

SPECIFICATIONS

features_provided	PROGRAMMED
output_logic_form	BIPOLAR METAL-OXIDE SEMICONDUCTOR
inclosure_material	CERAMIC
memory_device_type	PROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	9 INPUT
hybrid_technology_type	MONOLITHIC
end_item_identification	AN/FPS-124
inclosure_configuration	DUAL-IN-LINE
terminal_surface_treatment	SOLDER
nondefinitive_spec/std_data	-209 NUMBER
NSN	5962-01-369-9244

COMPONENT DIAGRAM

KEY FEATURES

•

HYBRID TECHNOLOGY TYPE: MONOLITHIC

•

INPUT CIRCUIT PATTERN: 9 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

FEATURES PROVIDED: PROGRAMMED

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

CURRENT RATING PER CHARACTERISTIC: 30.00 MILLIAMPERES MINIMUM TRIP AND 5.00 MILLIAMPERES MAXIMUM INPUT

•

MEMORY DEVICE TYPE: PROM

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

HYBRID TECHNOLOGY TYPE	MONOLITHIC
INPUT CIRCUIT PATTERN	9 INPUT
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
FEATURES PROVIDED	PROGRAMMED
INCLOSURE CONFIGURATION	DUAL-IN-LINE
CURRENT RATING PER CHARACTERISTIC	30.00 MILLIAMPERES MINIMUM TRIP AND 5.00 MILLIAMPERES MAXIMUM INPUT
MEMORY DEVICE TYPE	PROM
CASE OUTLINE SOURCE AND DESIGNATOR	D-8 MIL-M-38510
SPECIFICATION/STANDARD DATA	56232-1219251 MANUFACTURERS SPECIFICATION

OTHER ITEMS IN FSC 5962 — Microcircuits, Electronic

Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.

5962-00-001-1861 5962-00-001-1901 5962-00-001-1902 5962-00-001-1905 5962-00-001-1906 5962-00-001-1907 5962-00-001-1908 5962-00-001-1909

SUBSTITUTES & CROSS-REFERENCES 2

ROM/PROMReference document

Same NSN cross-reference

Reference document — Secondary reference

5962-8769002RAReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)

Ready to buy 1219251-209?

Compare prices from verified sellers on eBay

Buy on eBay →

As an eBay Partner, PartsTable may earn a commission. Your price is not affected.

FREQUENTLY ASKED QUESTIONS

What is 1219251-209?

1219251-209 is a MICROCIRCUIT,MEMORY.

What parts can replace 1219251-209?

There are 2 known substitutes for 1219251-209: ROM/PROM, 5962-8769002RA. Substitute compatibility should be verified for your specific system.

What is the NSN for 1219251-209?

1219251-209 is cataloged in the U.S. Government catalog under NSN 5962-01-369-9244. This indicates validated use in U.S. government and defense supply chains.

Community Feedback

1219251-209 — MICROCIRCUIT,MEMORY

Request a Quote — 1219251-209