1217AS797 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

1217AS797: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.595 INCHES MINIMUM AND 0.635 INCHES MAXIMUM IN, body_height: 0.280 INCHES MAXIMUM IN, body_length: 2.970 INCHES MAXIMUM IN, features_provided: MONOLITHIC AND STATIC OPERATION, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-332-1184, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

1217AS797

NSN: 5962-01-332-1184
FSC: 5962 — Microcircuits, Electronic
CAGE: 30003 — NAVAL AIR SYSTEMS COMMAND MANAGED ORIGINAL DESIGN ACTIVITY NOT MATERIAL/PARTS SUPPLIER (USA)

SPECIFICATIONS

body_width	0.595 INCHES MINIMUM AND 0.635 INCHES MAXIMUM IN
body_height	0.280 INCHES MAXIMUM IN
body_length	2.970 INCHES MAXIMUM IN
features_provided	MONOLITHIC AND STATIC OPERATION
output_logic_form	COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	ROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	44 INPUT
inclosure_configuration	DUAL-IN-LINE
terminal_surface_treatment	SOLDER
NSN	5962-01-332-1184

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 44 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.595 INCHES MINIMUM AND 0.635 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.280 INCHES MAXIMUM IN

•

FEATURES PROVIDED: MONOLITHIC AND STATIC OPERATION

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

MEMORY DEVICE TYPE: ROM

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	44 INPUT
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.595 INCHES MINIMUM AND 0.635 INCHES MAXIMUM IN
BODY HEIGHT	0.280 INCHES MAXIMUM IN
FEATURES PROVIDED	MONOLITHIC AND STATIC OPERATION
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	ROM
BODY LENGTH	2.970 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC

OTHER ITEMS IN FSC 5962 — Microcircuits, Electronic

Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.

5962-00-001-1861 5962-00-001-1901 5962-00-001-1902 5962-00-001-1905 5962-00-001-1906 5962-00-001-1907 5962-00-001-1908 5962-00-001-1909

SUBSTITUTES & CROSS-REFERENCES 1

IDT7M135S140CBReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — mutilation + specific procedure

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FREQUENTLY ASKED QUESTIONS

What is 1217AS797?

1217AS797 is a MICROCIRCUIT,MEMORY.

What parts can replace 1217AS797?

There is 1 known substitute for 1217AS797: IDT7M135S140CB. Substitute compatibility should be verified for your specific system.

What is the NSN for 1217AS797?

1217AS797 is cataloged in the U.S. Government catalog under NSN 5962-01-332-1184. This indicates validated use in U.S. government and defense supply chains.

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