SOCKET,PLUG-IN ELECTRONIC COMPON. Key specifications include material: COPPER ALLOY CONTACT, precious_material: SILVER, surface_treatment: SILVER CONTACT, fabrication_method: MOLDED, terminal_type_and_quantity: 3 TAB, SOLDER LUG, precious_material_and_weight: 0.015 SILVER GRAINS, TROY. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5935-00-940-3165, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| material | COPPER ALLOY CONTACT |
| precious_material | SILVER |
| surface_treatment | SILVER CONTACT |
| fabrication_method | MOLDED |
| terminal_type_and_quantity | 3 TAB, SOLDER LUG |
| precious_material_and_weight | 0.015 SILVER GRAINS, TROY |
| accommodated_contact_quantity | 3 |
| precious_material_and_location | CONTACT SURFACES SILVER |
| specific_equipment_accommodated | SEMICONDUCTOR DEVICE |
| NSN | 5935-00-940-3165 |
| FABRICATION METHOD | MOLDED |
| PRECIOUS MATERIAL AND WEIGHT | 0.015 SILVER GRAINS, TROY |
| MATERIAL | COPPER ALLOY CONTACT |
| TERMINAL TYPE AND QUANTITY | 3 TAB, SOLDER LUG |
| PRECIOUS MATERIAL AND LOCATION | CONTACT SURFACES SILVER |
| SURFACE TREATMENT | SILVER CONTACT |
| PRECIOUS MATERIAL | SILVER |
| ACCOMMODATED CONTACT QUANTITY | 3 |
| SPECIFIC EQUIPMENT ACCOMMODATED | SEMICONDUCTOR DEVICE |