12-690362-20: SEMICONDUCTOR DEVICE,THYRISTOR.
The SEMICONDUCTOR DEVICE,THYRISTOR is a the manufacturer industrial component. Key specifications include overall_length: 1.000 INCHES MINIMUM IN, mounting_method: PRESS FIT, overall_diameter: 2.200 INCHES MINIMUM IN, special_features: JUNCTION PATTERN ARRANGEMENT: PNPN, features_provided: HERMETICALLY SEALED CASE, internal_configuration: JUNCTION CONTACT. This part is cataloged in the U.S.
Government catalog under NSN 5961-01-192-8708, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| overall_length | 1.000 INCHES MINIMUM IN |
| mounting_method | PRESS FIT |
| overall_diameter | 2.200 INCHES MINIMUM IN |
| special_features | JUNCTION PATTERN ARRANGEMENT: PNPN |
| features_provided | HERMETICALLY SEALED CASE |
| internal_configuration | JUNCTION CONTACT |
| semiconductor_material | SILICON |
| terminal_type_and_quantity | 3 UNINSULATED WIRE LEAD W/TERMINAL LUG |
| current_rating_per_characteristic | 200.00 AMPERES MAXIMUM REVERSE CURRENT, DC |
| voltage_rating_in_volts_per_characteristic | 50.0 MAXIMUM REVERSE VOLTAGE, DC |
| maximum_operating_temp_per_measurement_point | 125.0 CELSIUS JUNCTION DEGC |
| NSN | 5961-01-192-8708 |
| VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 50.0 MAXIMUM REVERSE VOLTAGE, DC |
| MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 125.0 CELSIUS JUNCTION DEGC |
| OVERALL DIAMETER | 2.200 INCHES MINIMUM IN |
| MOUNTING METHOD | PRESS FIT |
| SEMICONDUCTOR MATERIAL | SILICON |
| OVERALL LENGTH | 1.000 INCHES MINIMUM IN |
| INTERNAL CONFIGURATION | JUNCTION CONTACT |
| FEATURES PROVIDED | HERMETICALLY SEALED CASE |
| CURRENT RATING PER CHARACTERISTIC | 200.00 AMPERES MAXIMUM REVERSE CURRENT, DC |
| SPECIAL FEATURES | JUNCTION PATTERN ARRANGEMENT: PNPN |