11K2718PC3: 11K2718PC3.
The 11K2718PC3 is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include material: SILVER CONTACT, overall_width: 0.562 INCHES NOMINAL IN, overall_height: 0.438 INCHES NOMINAL IN, overall_length: 0.750 INCHES NOMINAL IN, point_diameter: 0.109 INCHES NOMINAL IN, mounting_method: UNTHREADED HOLE(S). This part is cataloged in the U.S.
Government catalog under NSN 5999-00-030-1908, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| material | SILVER CONTACT |
| overall_width | 0.562 INCHES NOMINAL IN |
| overall_height | 0.438 INCHES NOMINAL IN |
| overall_length | 0.750 INCHES NOMINAL IN |
| point_diameter | 0.109 INCHES NOMINAL IN |
| mounting_method | UNTHREADED HOLE(S) |
| style_designator | LEAF TAP CONTACT W/ ROUND FLATTED FIXED POINT |
| precious_material | SILVER |
| current_rating_in_amps | 25.0 |
| mounting_facility_quantity | 1 |
| precious_material_and_weight | 0.005 SILVER GRAINS, TROY |
| precious_material_and_location | CONTACT SILVER |
| NSN | 5999-00-030-1908 |
| OVERALL HEIGHT | 0.438 INCHES NOMINAL IN |
| POINT DIAMETER | 0.109 INCHES NOMINAL IN |
| MOUNTING FACILITY QUANTITY | 1 |
| PRECIOUS MATERIAL | SILVER |
| MOUNTING METHOD | UNTHREADED HOLE(S) |
| UNTHREADED MOUNTING HOLE DIAMETER | 0.164 INCHES NOMINAL IN |
| STYLE DESIGNATOR | LEAF TAP CONTACT W/ ROUND FLATTED FIXED POINT |
| PRECIOUS MATERIAL AND WEIGHT | 0.005 SILVER GRAINS, TROY |
| OVERALL LENGTH | 0.750 INCHES NOMINAL IN |
| OVERALL WIDTH | 0.562 INCHES NOMINAL IN |