The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN, body_height: 0.055 INCHES MINIMUM AND 0.140 INCHES MAXIMUM IN, body_length: 0.745 INCHES MINIMUM AND 0.770 INCHES MAXIMUM IN, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC AND GLASS, storage_temp_range: -65.0 TO 150.0 CELSIUS DEGC. This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-015-2170, indicating validated use in U.S.
government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels. Verify compatibility with your specific system configuration before ordering.
| body_width | 0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN |
| body_height | 0.055 INCHES MINIMUM AND 0.140 INCHES MAXIMUM IN |
| body_length | 0.745 INCHES MINIMUM AND 0.770 INCHES MAXIMUM IN |
| features_provided | MONOLITHIC AND HERMETICALLY SEALED AND POSITIVE OUTPUTS AND LOW POWER AND EDGE TRIGGERED AND NEGATIVE EDGE TRIGGERED AND RETRIGGERABLE AND W/ENABLE AND TRUE/COMPLEMENTARY AND W/BUFFERED OUTPUT |
| output_logic_form | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| inclosure_material | CERAMIC AND GLASS |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| test_data_document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | 8 INPUT |
| inclosure_configuration | DUAL-IN-LINE |
| terminal_surface_treatment | SOLDER |
| NSN | 5962-01-015-2170 |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS DEGC |
| TERMINAL TYPE AND QUANTITY | 14 PRINTED CIRCUIT |
| FEATURES PROVIDED | MONOLITHIC AND HERMETICALLY SEALED AND POSITIVE OUTPUTS AND LOW POWER AND EDGE TRIGGERED AND NEGATIVE EDGE TRIGGERED AND RETRIGGERABLE AND W/ENABLE AND TRUE/COMPLEMENTARY AND W/BUFFERED OUTPUT |
| OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CASE OUTLINE SOURCE AND DESIGNATOR | -0-001-AD JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
| INCLOSURE MATERIAL | CERAMIC AND GLASS |
| MAXIMUM POWER DISSIPATION RATING | 200.0 MILLIWATTS |
| OPERATING TEMP RANGE | -55.0 TO 125.0 CELSIUS DEGC |
| TERMINAL SURFACE TREATMENT | SOLDER |
| BODY HEIGHT | 0.055 INCHES MINIMUM AND 0.140 INCHES MAXIMUM IN |