115373-1 — MICROCIRCUIT,DIGITAL

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

115373-1: MICROCIRCUIT,DIGITAL.

The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN, body_height: 0.185 INCHES MAXIMUM IN, body_length: 1.060 INCHES MAXIMUM IN, features_provided: BURN IN AND ELECTROSTATIC SENSITIVE AND BIPOLAR AND PROGRAMMED AND MONOLITHIC, inclosure_material: CERAMIC, memory_device_type: PAL. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-340-9542, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

115373-1

NSN: 5962-01-340-9542
FSC: 5962 — Microcircuits, Electronic
CAGE: 9Y580 — L3HARRIS TECHNOLOGIES, INC. (USA)

SPECIFICATIONS

body_width	0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
body_height	0.185 INCHES MAXIMUM IN
body_length	1.060 INCHES MAXIMUM IN
features_provided	BURN IN AND ELECTROSTATIC SENSITIVE AND BIPOLAR AND PROGRAMMED AND MONOLITHIC
inclosure_material	CERAMIC
memory_device_type	PAL
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	16 INPUT
inclosure_configuration	DUAL-IN-LINE
terminal_surface_treatment	SOLDER
NSN	5962-01-340-9542

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 16 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.185 INCHES MAXIMUM IN

•

FEATURES PROVIDED: BURN IN AND ELECTROSTATIC SENSITIVE AND BIPOLAR AND PROGRAMMED AND MONOLITHIC

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

MEMORY DEVICE TYPE: PAL

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	16 INPUT
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
BODY HEIGHT	0.185 INCHES MAXIMUM IN
FEATURES PROVIDED	BURN IN AND ELECTROSTATIC SENSITIVE AND BIPOLAR AND PROGRAMMED AND MONOLITHIC
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	PAL
CASE OUTLINE SOURCE AND DESIGNATOR	D-8 MIL-M-38510
BODY LENGTH	1.060 INCHES MAXIMUM IN

SUBSTITUTES & CROSS-REFERENCES 3

ROM/PROMReference document

Same NSN cross-reference

Reference document — Secondary reference

5962-3850402BRAReference document

Same NSN cross-reference

Reference document — Secondary reference

M38510/50402BRAReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is 115373-1?

115373-1 is a MICROCIRCUIT,DIGITAL.

What parts can replace 115373-1?

There are 3 known substitutes for 115373-1: ROM/PROM, 5962-3850402BRA, M38510/50402BRA. Substitute compatibility should be verified for your specific system.

What is the NSN for 115373-1?

115373-1 is cataloged in the U.S. Government catalog under NSN 5962-01-340-9542. This indicates validated use in U.S. government and defense supply chains.

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115373-1 — MICROCIRCUIT,DIGITAL

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