11475099 — MICROCIRCUIT,HYBRID

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

11475099: MICROCIRCUIT,HYBRID.

The MICROCIRCUIT,HYBRID is a the manufacturer industrial component. Key specifications include body_width: 0.570 INCHES MINIMUM AND 0.580 INCHES MAXIMUM IN, body_height: 0.170 INCHES MAXIMUM IN, body_length: 1.150 INCHES MINIMUM AND 1.162 INCHES MAXIMUM IN, special_features: 12.5 DB GAIN DB, features_provided: ELECTROSTATIC SENSITIVE AND WIDEBAND AND LOW POWER, storage_temp_range: -55.0 TO 150.0 CELSIUS DEGC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-464-6252, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

11475099

NSN: 5962-01-464-6252
FSC: 5962 — Microcircuits, Electronic
CAGE: 18876 — US ARMY AVIATION AND MISSILE COMMAND (USA)

SPECIFICATIONS

body_width	0.570 INCHES MINIMUM AND 0.580 INCHES MAXIMUM IN
body_height	0.170 INCHES MAXIMUM IN
body_length	1.150 INCHES MINIMUM AND 1.162 INCHES MAXIMUM IN
special_features	12.5 DB GAIN DB
features_provided	ELECTROSTATIC SENSITIVE AND WIDEBAND AND LOW POWER
storage_temp_range	-55.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-45.6 TO 85.0 CELSIUS DEGC
hybrid_technology_type	MULTICHIP
inclosure_configuration	FLAT PACK
terminal_surface_treatment	SOLDER
terminal_type_and_quantity	10 FLAT LEADS
NSN	5962-01-464-6252

COMPONENT DIAGRAM

KEY FEATURES

•

HYBRID TECHNOLOGY TYPE: MULTICHIP

•

TERMINAL SURFACE TREATMENT: SOLDER

•

DESIGN FUNCTION AND QUANTITY: 1 AMPLIFIER, RADIO FREQUENCY

•

BODY WIDTH: 0.570 INCHES MINIMUM AND 0.580 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.170 INCHES MAXIMUM IN

•

FEATURES PROVIDED: ELECTROSTATIC SENSITIVE AND WIDEBAND AND LOW POWER

•

INCLOSURE CONFIGURATION: FLAT PACK

•

BODY LENGTH: 1.150 INCHES MINIMUM AND 1.162 INCHES MAXIMUM IN

TECHNICAL CHARACTERISTICS

HYBRID TECHNOLOGY TYPE	MULTICHIP
TERMINAL SURFACE TREATMENT	SOLDER
DESIGN FUNCTION AND QUANTITY	1 AMPLIFIER, RADIO FREQUENCY
BODY WIDTH	0.570 INCHES MINIMUM AND 0.580 INCHES MAXIMUM IN
BODY HEIGHT	0.170 INCHES MAXIMUM IN
FEATURES PROVIDED	ELECTROSTATIC SENSITIVE AND WIDEBAND AND LOW POWER
INCLOSURE CONFIGURATION	FLAT PACK
BODY LENGTH	1.150 INCHES MINIMUM AND 1.162 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-55.0 TO 150.0 CELSIUS DEGC
SPECIAL FEATURES	12.5 DB GAIN DB

OTHER ITEMS IN FSC 5962 — Microcircuits, Electronic

Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.

5962-00-001-1861 5962-00-001-1901 5962-00-001-1902 5962-00-001-1905 5962-00-001-1906 5962-00-001-1907 5962-00-001-1908 5962-00-001-1909

SUBSTITUTES & CROSS-REFERENCES 1

G601854Reference document

Same NSN cross-reference

Reference document — Design control — primary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Semi-active item — no replacement plannedDemilitarization required — mutilation + specific procedure

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FREQUENTLY ASKED QUESTIONS

What is 11475099?

11475099 is a MICROCIRCUIT,HYBRID.

What parts can replace 11475099?

There is 1 known substitute for 11475099: G601854. Substitute compatibility should be verified for your specific system.

What is the NSN for 11475099?

11475099 is cataloged in the U.S. Government catalog under NSN 5962-01-464-6252. This indicates validated use in U.S. government and defense supply chains.

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11475099 — MICROCIRCUIT,HYBRID

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