11475093-1 — MICROCIRCUIT,HYBRID

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

11475093-1: MICROCIRCUIT,HYBRID.

The MICROCIRCUIT,HYBRID is a the manufacturer industrial component. Key specifications include body_width: 0.160 INCHES NOMINAL IN, body_height: 0.500 INCHES NOMINAL IN, body_length: 0.625 INCHES NOMINAL IN, overall_height: 1.20 INCHES NOMINAL IN, features_provided: ELECTROSTATIC SENSITIVE, storage_temp_range: -55.0 TO 150.0 CELSIUS DEGC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-464-6257, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

11475093-1

NSN: 5962-01-464-6257
NIINs: 014646257, 016436676
FSC: 5962 — Microcircuits, Electronic
CAGE: 28983 — DAICO INDUSTRIES, INC. DBA DAICO INDUSTRIES INC (USA)

SPECIFICATIONS

body_width	0.160 INCHES NOMINAL IN
body_height	0.500 INCHES NOMINAL IN
body_length	0.625 INCHES NOMINAL IN
overall_height	1.20 INCHES NOMINAL IN
features_provided	ELECTROSTATIC SENSITIVE
storage_temp_range	-55.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-45.6 TO 85.0 CELSIUS DEGC
hybrid_technology_type	MULTICHIP
supplementary_features	AMBIENT OPERATING TEMPERATURE RANGE: -45.C TO +85C,JUNCTION TEMPERATURE +110C,SUPPLY VOLTAGE (PIN 4) +5.0VDC,SUPPLY VOLTAGE (PIN 9) -5.0VDC,FREQUENCY RANGE 100-250MHZ MHz
inclosure_configuration	FLAT PACK
terminal_surface_treatment	SOLDER
NSN	5962-01-464-6257

COMPONENT DIAGRAM

KEY FEATURES

•

HYBRID TECHNOLOGY TYPE: MULTICHIP

•

TERMINAL SURFACE TREATMENT: SOLDER

•

DESIGN FUNCTION AND QUANTITY: 1 SWITCH

•

BODY WIDTH: 0.500 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.160 INCHES MAXIMUM IN

•

FEATURES PROVIDED: ELECTROSTATIC SENSITIVE

•

INCLOSURE CONFIGURATION: FLAT PACK

•

BODY LENGTH: 0.625 INCHES MAXIMUM IN

TECHNICAL CHARACTERISTICS

HYBRID TECHNOLOGY TYPE	MULTICHIP
TERMINAL SURFACE TREATMENT	SOLDER
DESIGN FUNCTION AND QUANTITY	1 SWITCH
BODY WIDTH	0.500 INCHES MAXIMUM IN
BODY HEIGHT	0.160 INCHES MAXIMUM IN
FEATURES PROVIDED	ELECTROSTATIC SENSITIVE
INCLOSURE CONFIGURATION	FLAT PACK
BODY LENGTH	0.625 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-55.0 TO 150.0 CELSIUS DEGC
VOLTAGE RATING AND TYPE PER CHARACTERISTIC	12.5 VOLTS MAXIMUM INPUT

SUBSTITUTES & CROSS-REFERENCES 3

11475093-001Reference document

Same NSN cross-reference

Reference document — Secondary reference

G601860-001Reference document

Same NSN cross-reference

Reference document — Design control — primary reference

G601860Reference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Terminal item — stock exhausted; no further procurementDemilitarization required — mutilation + specific procedure

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FREQUENTLY ASKED QUESTIONS

What is 11475093-1?

11475093-1 is a MICROCIRCUIT,HYBRID.

What parts can replace 11475093-1?

There are 3 known substitutes for 11475093-1: 11475093-001, G601860-001, G601860. Substitute compatibility should be verified for your specific system.

What is the NSN for 11475093-1?

11475093-1 is cataloged in the U.S. Government catalog under NSN 5962-01-464-6257. This indicates validated use in U.S. government and defense supply chains.

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11475093-1 — MICROCIRCUIT,HYBRID

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