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113772 — MICROCIRCUIT,MEMORY

✓ Government record, cited
— · COMPONENT
PRODUCT OVERVIEW

113772: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include material: ALUMINUM ALLOY 2024, body_width: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN, body_height: 0.185 INCHES MAXIMUM IN, body_length: 0.960 INCHES MAXIMUM IN, overall_height: 0.325 INCHES NOMINAL IN, shank_diameter: 0.125 INCHES NOMINAL IN. This part is cataloged in the U.S.

Government catalog under NSN 1650-00-072-9022, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
113772
NSN: 1650-00-072-9022
NIINs: 000729022, 011689792, 017338734
FSC: 1650 — Aircraft Hydraulic, Vacuum, and De-icing System Components
CAGE: 81982 — HYDRO-AIRE AEROSPACE CORP (USA)
SPECIFICATIONS
materialALUMINUM ALLOY 2024
body_width0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
body_height0.185 INCHES MAXIMUM IN
body_length0.960 INCHES MAXIMUM IN
overall_height0.325 INCHES NOMINAL IN
shank_diameter0.125 INCHES NOMINAL IN
flange_diameter0.420 INCHES NOMINAL IN
special_featuresTYPE T ANODIZED PER MIL-A-8625;UPPER END OF SHANK IS SHOULDERED,0.195 IN.MIN AND 0.200 IN. MAX IN
style_designatorPOPPET
features_providedHERMETICALLY SEALED AND MONOLITHIC AND STATIC OPERATION AND W/ENABLE AND BURN IN
output_logic_formN-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_materialCERAMIC
NSN1650-00-072-9022
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN 113772 MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
SHANK DIAMETER: 0.125 INCHES NOMINAL IN
•
FLANGE DIAMETER: 0.420 INCHES NOMINAL IN
•
STYLE DESIGNATOR: POPPET
•
MATERIAL DOCUMENT AND CLASSIFICATION: 2024, T4 FED SPEC SINGLE MATERIAL RESPONSE
•
MEDIA FOR WHICH DESIGNED: AIR
•
MATERIAL: ALUMINUM ALLOY 2024
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS
SHANK DIAMETER0.125 INCHES NOMINAL IN
FLANGE DIAMETER0.420 INCHES NOMINAL IN
OVERALL HEIGHT0.325 INCHES NOMINAL IN
STYLE DESIGNATORPOPPET
MATERIAL DOCUMENT AND CLASSIFICATION2024, T4 FED SPEC SINGLE MATERIAL RESPONSE
SPECIAL FEATURESTYPE T ANODIZED PER MIL-A-8625;UPPER END OF SHANK IS SHOULDERED,0.195 IN.MIN AND 0.200 IN. MAX IN
MEDIA FOR WHICH DESIGNEDAIR
MATERIALALUMINUM ALLOY 2024
SUBSTITUTES & CROSS-REFERENCES

No substitute or cross-reference records for this part.

LIFECYCLE
NSN statusCancelled· U.S. Government catalog
Acquisition advice: Insurance item — stocked against contingency demandNo demilitarization required
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FREQUENTLY ASKED QUESTIONS
What is 113772?
113772 is a MICROCIRCUIT,MEMORY.
What is the NSN for 113772?
113772 is cataloged in the U.S. Government catalog under NSN 1650-00-072-9022. This indicates validated use in U.S. government and defense supply chains.
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