The ELECTRONIC COMPONENTS ASSEMBLY is a the manufacturer industrial component. Key specifications include height: 2.500 INCHES NOMINAL IN, length: 11.750 INCHES NOMINAL IN, diameter: 2.300 INCHES NOMINAL IN, material: COPPER ALLOY HOUSING, overall_width: 0.9688 INCHES NOMINAL IN, outside_diameter: 4.1250 INCHES NOMINAL IN. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5998-00-415-3977, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| height | 2.500 INCHES NOMINAL IN |
| length | 11.750 INCHES NOMINAL IN |
| diameter | 2.300 INCHES NOMINAL IN |
| material | COPPER ALLOY HOUSING |
| overall_width | 0.9688 INCHES NOMINAL IN |
| outside_diameter | 4.1250 INCHES NOMINAL IN |
| special_features | RESISTOR 4,SEMICONDUCTOR DEVICE DIODE 1,TERMINAL BOARD 1 |
| style_designator | COILED PLAIN TYPE |
| material_thickness | 2.3000 INCHES NOMINAL IN |
| heat_transfer_method | INDIRECT |
| backface_corner_radius | 0.1250 INCHES NOMINAL IN |
| end_item_identification | 2420-66-148-7692, HMEE (HIGH MOBILITY ENGINEER EXCAVATOR); MRAP BUFFALO MK2A2 |
| NSN | 5998-00-415-3977 |
| SPECIAL FEATURES | RESISTOR 4,SEMICONDUCTOR DEVICE DIODE 1,TERMINAL BOARD 1 |
| SPECIAL FEATURES | RESISTOR 4,SEMICONDUCTOR DEVICE DIODE 1,TERMINAL BOARD 1 |