111040-001 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

111040-001: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include features_provided: HERMETICALLY SEALED AND BURN IN AND PROGRAMMED, inclosure_material: CERAMIC, memory_device_type: PAL, test_data_document: 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.)., operating_temp_range: -55.0 TO 125.0 CELSIUS DEGC, inclosure_configuration: DUAL-IN-LINE. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-393-8409, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

111040-001

NSN: 5962-01-393-8409
FSC: 5962 — Microcircuits, Electronic
CAGE: 35012 — GE AVIATION SYSTEMS LLC (USA)

SPECIFICATIONS

features_provided	HERMETICALLY SEALED AND BURN IN AND PROGRAMMED
inclosure_material	CERAMIC
memory_device_type	PAL
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
inclosure_configuration	DUAL-IN-LINE
terminal_surface_treatment	SOLDER
time_rating_per_chacteristic	20.00 NANOSECONDS MAXIMUM ACCESS NS
case_outline_source_and_designator	D-9 MIL-M-38510
voltage_rating_and_type_per_characteristic	7.0 VOLTS MAXIMUM POWER SOURCE
NSN	5962-01-393-8409

COMPONENT DIAGRAM

KEY FEATURES

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND PROGRAMMED

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

MEMORY DEVICE TYPE: PAL

•

CASE OUTLINE SOURCE AND DESIGNATOR: D-9 MIL-M-38510

•

VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 7.0 VOLTS MAXIMUM POWER SOURCE

•

OPERATING TEMP RANGE: -55.0 TO 125.0 CELSIUS DEGC

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
FEATURES PROVIDED	HERMETICALLY SEALED AND BURN IN AND PROGRAMMED
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	PAL
CASE OUTLINE SOURCE AND DESIGNATOR	D-9 MIL-M-38510
VOLTAGE RATING AND TYPE PER CHARACTERISTIC	7.0 VOLTS MAXIMUM POWER SOURCE
OPERATING TEMP RANGE	-55.0 TO 125.0 CELSIUS DEGC
TEST DATA DOCUMENT	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
TERMINAL TYPE AND QUANTITY	24 PRINTED CIRCUIT

SUBSTITUTES & CROSS-REFERENCES 2

ROM/PROMReference document

Same NSN cross-reference

Reference document — Secondary reference

5962-8867004LAReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is 111040-001?

111040-001 is a MICROCIRCUIT,MEMORY.

What parts can replace 111040-001?

There are 2 known substitutes for 111040-001: ROM/PROM, 5962-8867004LA. Substitute compatibility should be verified for your specific system.

What is the NSN for 111040-001?

111040-001 is cataloged in the U.S. Government catalog under NSN 5962-01-393-8409. This indicates validated use in U.S. government and defense supply chains.

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