The SEMICONDUCTOR DEVICE,DIODE is a the manufacturer industrial component. Key specifications include material: SILICON SEMICONDUCTOR, overall_length: 1.094 INCHES MINIMUM AND 1.125 INCHES MAXIMUM IN, mounting_method: CLIP, terminal_type_and_quantity: 2 FERRULE, current_rating_per_characteristic: 5.00 AMPERES MAXIMUM FORWARD CURRENT, AVERAGE, voltage_rating_in_volts_per_characteristic: 200.0 MAXIMUM REVERSE VOLTAGE, INSTANTANEOUS. This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5961-01-023-1181, indicating validated use in U.S.
government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels. Verify compatibility with your specific system configuration before ordering.
| material | SILICON SEMICONDUCTOR |
| overall_length | 1.094 INCHES MINIMUM AND 1.125 INCHES MAXIMUM IN |
| mounting_method | CLIP |
| terminal_type_and_quantity | 2 FERRULE |
| current_rating_per_characteristic | 5.00 AMPERES MAXIMUM FORWARD CURRENT, AVERAGE |
| voltage_rating_in_volts_per_characteristic | 200.0 MAXIMUM REVERSE VOLTAGE, INSTANTANEOUS |
| maximum_operating_temp_per_measurement_point | 170.0 CELSIUS CASE DEGC |
| NSN | 5961-01-023-1181 |
| MATERIAL | SILICON SEMICONDUCTOR |
| VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 200.0 MAXIMUM REVERSE VOLTAGE, INSTANTANEOUS |
| CURRENT RATING PER CHARACTERISTIC | 5.00 AMPERES MAXIMUM FORWARD CURRENT, AVERAGE |
| MOUNTING METHOD | CLIP |
| OVERALL LENGTH | 1.094 INCHES MINIMUM AND 1.125 INCHES MAXIMUM IN |
| MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 170.0 CELSIUS CASE DEGC |
| MATERIAL | CERAMIC ENCLOSURE |
| TERMINAL TYPE AND QUANTITY | 2 FERRULE |