10H516M/B2AJC — MICROCIRCUIT,DIGITAL

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

10H516M/B2AJC: MICROCIRCUIT,DIGITAL.

The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM IN, body_height: 0.060 INCHES MINIMUM AND 0.100 INCHES MAXIMUM IN, body_length: 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM IN, features_provided: BURN IN AND MONOLITHIC, output_logic_form: EMITTER-COUPLED LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-357-5428, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

10H516M/B2AJC

NSN: 5962-01-357-5428
FSC: 5962 — Microcircuits, Electronic
CAGE: 04713 — FREESCALE SEMICONDUCTOR, INC. (USA)

SPECIFICATIONS

body_width	0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM IN
body_height	0.060 INCHES MINIMUM AND 0.100 INCHES MAXIMUM IN
body_length	0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM IN
features_provided	BURN IN AND MONOLITHIC
output_logic_form	EMITTER-COUPLED LOGIC
inclosure_material	CERAMIC
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	6 INPUT
inclosure_configuration	LEADLESS FLAT PACK
terminal_surface_treatment	SOLDER
NSN	5962-01-357-5428

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 6 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

DESIGN FUNCTION AND QUANTITY: 3 RECEIVER, LINE

•

BODY WIDTH: 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.060 INCHES MINIMUM AND 0.100 INCHES MAXIMUM IN

•

FEATURES PROVIDED: BURN IN AND MONOLITHIC

•

INCLOSURE CONFIGURATION: LEADLESS FLAT PACK

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	6 INPUT
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
DESIGN FUNCTION AND QUANTITY	3 RECEIVER, LINE
BODY WIDTH	0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM IN
BODY HEIGHT	0.060 INCHES MINIMUM AND 0.100 INCHES MAXIMUM IN
FEATURES PROVIDED	BURN IN AND MONOLITHIC
INCLOSURE CONFIGURATION	LEADLESS FLAT PACK
CURRENT RATING PER CHARACTERISTIC	95.00 NANOAMPERES MAXIMUM INPUT
CASE OUTLINE SOURCE AND DESIGNATOR	C-2 MIL-M-38510

SUBSTITUTES & CROSS-REFERENCES 4

5962-87502012ASame NSN cross-reference

Same NSN cross-reference

Also cataloged under this NSN

5962-87502012XReference document

Same NSN cross-reference

Reference document — Advisory reference — outside the item-of-supply concept

5962-87502012BReference document

Same NSN cross-reference

Reference document — Secondary reference

5962-87502Reference document

Same NSN cross-reference

Reference document — Identification reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — mutilation + specific procedure

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FREQUENTLY ASKED QUESTIONS

What is 10H516M/B2AJC?

10H516M/B2AJC is a MICROCIRCUIT,DIGITAL.

What parts can replace 10H516M/B2AJC?

There are 4 known substitutes for 10H516M/B2AJC: 5962-87502012A, 5962-87502012X, 5962-87502012B and 1 more. Substitute compatibility should be verified for your specific system.

What is the NSN for 10H516M/B2AJC?

10H516M/B2AJC is cataloged in the U.S. Government catalog under NSN 5962-01-357-5428. This indicates validated use in U.S. government and defense supply chains.

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