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10942143 — MICROCIRCUIT,MEMORY

✓ Government record, cited
— · ORING SEAL
PRODUCT OVERVIEW

10942143: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include material: ASBESTOS AND RUBBER BUTADIENE-ACRYLONITRILE CLASS NBR OVERALL, body_width: 0.600 INCHES MAXIMUM IN, body_height: 0.187 INCHES MAXIMUM IN, body_length: 1.285 INCHES MAXIMUM IN, hole_diameter: 0.250 INCHES NOMINAL LOCATION NOT OTHERWISE SPECIFIED IN, overall_width: 1.312 INCHES NOMINAL IN. This part is cataloged in the U.S.

Government catalog under NSN 5330-00-918-4153, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
10942143
NSN: 5330-00-918-4153
NIINs: 009184153, 013395878
FSC: 5330 — Packing and Gasket Materials
CAGE: 19207 — U S ARMY TANK AUTOMOTIVE COMMAND AMSTA-IM-MM (USA)
SPECIFICATIONS
materialASBESTOS AND RUBBER BUTADIENE-ACRYLONITRILE CLASS NBR OVERALL
body_width0.600 INCHES MAXIMUM IN
body_height0.187 INCHES MAXIMUM IN
body_length1.285 INCHES MAXIMUM IN
hole_diameter0.250 INCHES NOMINAL LOCATION NOT OTHERWISE SPECIFIED IN
overall_width1.312 INCHES NOMINAL IN
overall_length1.500 INCHES NOMINAL IN
special_features2CORNERS 0.125 IN. DIA IN
features_providedHERMETICALLY SEALED AND BURN IN AND W/ENABLE AND ULTRAVIOLET ERASABLE
output_logic_formN-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_materialCERAMIC
memory_device_typeEPROM
NSN5330-00-918-4153
COMPONENT DIAGRAM
O-RING / SEAL — MATERIAL DETERMINES APPLICATION ID: — CROSS-SECTION CS: — SPECIFICATION Material: — Durometer: — Temp: — PN: 10942143 MFR: OEM ⚠ VERIFY BEFORE ORDERING Wrong material = failure. Viton for oil/fuel, EPDM for water/steam, Buna-N for general purpose, Silicone for food-grade. Chemical incompatibility causes swelling, brittleness, or rapid degradation ✓ BROKER TIP Durometer (hardness) affects sealing pressure tolerance. Higher Shore A = harder = higher pressure. Standard durometer is 70A — verify if application requires different hardness PARTSTABLE TECHNICAL DRAWING — NOT TO SCALE
KEY FEATURES
•
CROSS-SECTIONAL THICKNESS: 0.015 INCHES NOMINAL IN
•
MATERIAL DOCUMENT AND CLASSIFICATION: MIL-G-12803 F1241-A MIL SPEC ALL MATERIAL RESPONSES OVERALL
•
CROSS-SECTIONAL SHAPE STYLE: SOLID SINGLE OR COMPOSITION
•
CENTER TO CENTER DISTANCE BETWEEN BOLT HOLES ALONG WIDTH: 0.844 INCHES NOMINAL LOCATION NOT OTHERWISE SPECIFIED IN
•
OUTSIDE CORNER RADIUS: 0.125 INCHES NOMINAL IN
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS
CROSS-SECTIONAL THICKNESS0.015 INCHES NOMINAL IN
MATERIAL DOCUMENT AND CLASSIFICATIONMIL-G-12803 F1241-A MIL SPEC ALL MATERIAL RESPONSES OVERALL
OVERALL LENGTH1.500 INCHES NOMINAL IN
CROSS-SECTIONAL SHAPE STYLESOLID SINGLE OR COMPOSITION
OVERALL WIDTH1.312 INCHES NOMINAL IN
SPECIAL FEATURES2CORNERS 0.125 IN. DIA IN
CENTER TO CENTER DISTANCE BETWEEN BOLT HOLES ALONG WIDTH0.844 INCHES NOMINAL LOCATION NOT OTHERWISE SPECIFIED IN
OUTSIDE CORNER RADIUS0.125 INCHES NOMINAL IN
MATERIALASBESTOS AND RUBBER BUTADIENE-ACRYLONITRILE CLASS NBR OVERALL
HOLE DIAMETER0.250 INCHES NOMINAL LOCATION NOT OTHERWISE SPECIFIED IN
SUBSTITUTES & CROSS-REFERENCES

No substitute or cross-reference records for this part.

LIFECYCLE
NSN statusActive· U.S. Government catalog
No demilitarization required
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FREQUENTLY ASKED QUESTIONS
What is 10942143?
10942143 is a MICROCIRCUIT,MEMORY.
What is the NSN for 10942143?
10942143 is cataloged in the U.S. Government catalog under NSN 5330-00-918-4153. This indicates validated use in U.S. government and defense supply chains.
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