109421-42 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

109421-42: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.600 INCHES MAXIMUM IN, body_height: 0.187 INCHES MAXIMUM IN, body_length: 1.285 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND BURN IN AND W/ENABLE AND ULTRAVIOLET ERASABLE, output_logic_form: N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-339-5877, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

109421-42

NSN: 5962-01-339-5877
FSC: 5962 — Microcircuits, Electronic
CAGE: 9Y580 — L3HARRIS TECHNOLOGIES, INC. (USA)

SPECIFICATIONS

body_width	0.600 INCHES MAXIMUM IN
body_height	0.187 INCHES MAXIMUM IN
body_length	1.285 INCHES MAXIMUM IN
features_provided	HERMETICALLY SEALED AND BURN IN AND W/ENABLE AND ULTRAVIOLET ERASABLE
output_logic_form	N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	EPROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	13 INPUT
inclosure_configuration	DUAL-IN-LINE
NSN	5962-01-339-5877

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 13 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.600 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.187 INCHES MAXIMUM IN

•

CAPITANCE RATING PER CHARACTERISTIC: 6.00 INPUT PICOFARADS MAXIMUM AND 12.00 OUTPUT PICOFARADS MAXIMUM

•

FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND W/ENABLE AND ULTRAVIOLET ERASABLE

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	13 INPUT
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.600 INCHES MAXIMUM IN
BODY HEIGHT	0.187 INCHES MAXIMUM IN
CAPITANCE RATING PER CHARACTERISTIC	6.00 INPUT PICOFARADS MAXIMUM AND 12.00 OUTPUT PICOFARADS MAXIMUM
FEATURES PROVIDED	HERMETICALLY SEALED AND BURN IN AND W/ENABLE AND ULTRAVIOLET ERASABLE
INCLOSURE CONFIGURATION	DUAL-IN-LINE
CURRENT RATING PER CHARACTERISTIC	115.00 MILLIAMPERES MAXIMUM SUPPLY
MEMORY DEVICE TYPE	EPROM

SUBSTITUTES & CROSS-REFERENCES 2

ROM/PROMReference document

Same NSN cross-reference

Reference document — Secondary reference

111770-1Reference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is 109421-42?

109421-42 is a MICROCIRCUIT,MEMORY.

What parts can replace 109421-42?

There are 2 known substitutes for 109421-42: ROM/PROM, 111770-1. Substitute compatibility should be verified for your specific system.

What is the NSN for 109421-42?

109421-42 is cataloged in the U.S. Government catalog under NSN 5962-01-339-5877. This indicates validated use in U.S. government and defense supply chains.

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