1089771P011 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

1089771P011: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.302 INCHES MAXIMUM IN, body_height: 0.145 INCHES MINIMUM AND 0.175 INCHES MAXIMUM IN, body_length: 0.882 INCHES MINIMUM AND 0.925 INCHES MAXIMUM IN, bit_quantity: 8192, word_quantity: 2048, features_provided: HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND PROGRAMMABLE AND SCHOTTKY AND W/ENABLE AND 3-STATE OUTPUT. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-097-9299, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

1089771P011

NSN: 5962-01-097-9299
FSC: 5962 — Microcircuits, Electronic
CAGE: 94117 — BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC. DBA BAE SYSTEMS (USA)

SPECIFICATIONS

body_width	0.302 INCHES MAXIMUM IN
body_height	0.145 INCHES MINIMUM AND 0.175 INCHES MAXIMUM IN
body_length	0.882 INCHES MINIMUM AND 0.925 INCHES MAXIMUM IN
bit_quantity	8192
word_quantity	2048
features_provided	HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND PROGRAMMABLE AND SCHOTTKY AND W/ENABLE AND 3-STATE OUTPUT
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC AND GLASS
memory_device_type	ROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	+0.0 TO 70.0 CELSIUS DEGC
input_circuit_pattern	12 INPUT
NSN	5962-01-097-9299

COMPONENT DIAGRAM

KEY FEATURES

•

BIT QUANTITY: 8192

•

INPUT CIRCUIT PATTERN: 12 INPUT

•

WORD QUANTITY: 2048

•

INCLOSURE MATERIAL: CERAMIC AND GLASS

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.302 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.145 INCHES MINIMUM AND 0.175 INCHES MAXIMUM IN

•

FEATURES PROVIDED: HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND PROGRAMMABLE AND SCHOTTKY AND W/ENABLE AND 3-STATE OUTPUT

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

BIT QUANTITY	8192
INPUT CIRCUIT PATTERN	12 INPUT
WORD QUANTITY	2048
INCLOSURE MATERIAL	CERAMIC AND GLASS
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.302 INCHES MAXIMUM IN
BODY HEIGHT	0.145 INCHES MINIMUM AND 0.175 INCHES MAXIMUM IN
FEATURES PROVIDED	HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND PROGRAMMABLE AND SCHOTTKY AND W/ENABLE AND 3-STATE OUTPUT
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	ROM

OTHER ITEMS IN FSC 5962 — Microcircuits, Electronic

Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.

5962-00-001-1861 5962-00-001-1901 5962-00-001-1902 5962-00-001-1905 5962-00-001-1906 5962-00-001-1907 5962-00-001-1908 5962-00-001-1909

SUBSTITUTES & CROSS-REFERENCES 2

ROM/PROM FAMILY 007Reference document

Same NSN cross-reference

Reference document — Secondary reference

N82S185-1-5Reference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is 1089771P011?

1089771P011 is a MICROCIRCUIT,MEMORY.

What parts can replace 1089771P011?

There are 2 known substitutes for 1089771P011: ROM/PROM FAMILY 007, N82S185-1-5. Substitute compatibility should be verified for your specific system.

What is the NSN for 1089771P011?

1089771P011 is cataloged in the U.S. Government catalog under NSN 5962-01-097-9299. This indicates validated use in U.S. government and defense supply chains.

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