The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.265 INCHES MINIMUM AND 0.291 INCHES MAXIMUM IN, body_height: 0.200 INCHES NOMINAL IN, body_length: 0.755 INCHES MINIMUM AND 0.785 INCHES MAXIMUM IN, features_provided: PROGRAMMED, inclosure_material: CERAMIC, memory_device_type: PROM. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-060-6300, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.265 INCHES MINIMUM AND 0.291 INCHES MAXIMUM IN |
| body_height | 0.200 INCHES NOMINAL IN |
| body_length | 0.755 INCHES MINIMUM AND 0.785 INCHES MAXIMUM IN |
| features_provided | PROGRAMMED |
| inclosure_material | CERAMIC |
| memory_device_type | PROM |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| end_item_identification | C5-A |
| inclosure_configuration | DUAL-IN-LINE |
| terminal_surface_treatment | SOLDER |
| NSN | 5962-01-060-6300 |
| BODY WIDTH | 0.265 INCHES MINIMUM AND 0.291 INCHES MAXIMUM IN |
| END ITEM IDENTIFICATION | C5-A |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS DEGC |
| BODY LENGTH | 0.755 INCHES MINIMUM AND 0.785 INCHES MAXIMUM IN |
| TERMINAL SURFACE TREATMENT | SOLDER |
| MEMORY DEVICE TYPE | PROM |
| BODY HEIGHT | 0.200 INCHES NOMINAL IN |
| INCLOSURE MATERIAL | CERAMIC |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| OPERATING TEMP RANGE | -55.0 TO 125.0 CELSIUS DEGC |