108052-003 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

108052-003: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN, body_height: 0.172 INCHES MINIMUM AND 0.217 INCHES MAXIMUM IN, body_length: 1.490 INCHES MAXIMUM IN, bit_quantity: 65536, word_quantity: 8192, overall_height: 0.432 INCHES MAXIMUM IN. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-341-3398, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

108052-003

NSN: 5962-01-341-3398
FSC: 5962 — Microcircuits, Electronic
CAGE: 35012 — GE AVIATION SYSTEMS LLC (USA)

SPECIFICATIONS

body_width	0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN
body_height	0.172 INCHES MINIMUM AND 0.217 INCHES MAXIMUM IN
body_length	1.490 INCHES MAXIMUM IN
bit_quantity	65536
word_quantity	8192
overall_height	0.432 INCHES MAXIMUM IN
features_provided	HERMETICALLY SEALED AND BURN IN AND ULTRAVIOLET ERASABLE AND MONOLITHIC AND ELECTROSTATIC SENSITIVE
output_logic_form	N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	EPROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
NSN	5962-01-341-3398

COMPONENT DIAGRAM

KEY FEATURES

•

BIT QUANTITY: 65536

•

INPUT CIRCUIT PATTERN: 16 INPUT

•

WORD QUANTITY: 8192

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.172 INCHES MINIMUM AND 0.217 INCHES MAXIMUM IN

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

BIT QUANTITY	65536
OVERALL HEIGHT	0.432 INCHES MAXIMUM IN
INPUT CIRCUIT PATTERN	16 INPUT
WORD QUANTITY	8192
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN
BODY HEIGHT	0.172 INCHES MINIMUM AND 0.217 INCHES MAXIMUM IN
FEATURES PROVIDED	HERMETICALLY SEALED AND BURN IN AND ULTRAVIOLET ERASABLE AND MONOLITHIC AND ELECTROSTATIC SENSITIVE
INCLOSURE CONFIGURATION	DUAL-IN-LINE

SUBSTITUTES & CROSS-REFERENCES 2

ROM/PROMReference document

Same NSN cross-reference

Reference document — Secondary reference

8200503YAReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is 108052-003?

108052-003 is a MICROCIRCUIT,MEMORY.

What parts can replace 108052-003?

There are 2 known substitutes for 108052-003: ROM/PROM, 8200503YA. Substitute compatibility should be verified for your specific system.

What is the NSN for 108052-003?

108052-003 is cataloged in the U.S. Government catalog under NSN 5962-01-341-3398. This indicates validated use in U.S. government and defense supply chains.

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108052-003 — MICROCIRCUIT,MEMORY

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