10800003 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

10800003: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.515 INCHES MINIMUM AND 0.600 INCHES MAXIMUM IN, body_height: 0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN, body_length: 1.235 INCHES MINIMUM AND 1.285 INCHES MAXIMUM IN, memory_capacity: UNKNOWN, features_provided: HERMETICALLY SEALED AND ULTRAVIOLET ERASABLE AND PROGRAMMABLE AND LOW POWER, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-162-3899, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

10800003

NSN: 5962-01-162-3899
NIINs: 011623899, 013517574, 016469452
FSC: 5962 — Microcircuits, Electronic
CAGE: 60942 — WTC INC (USA)

SPECIFICATIONS

body_width	0.515 INCHES MINIMUM AND 0.600 INCHES MAXIMUM IN
body_height	0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN
body_length	1.235 INCHES MINIMUM AND 1.285 INCHES MAXIMUM IN
memory_capacity	UNKNOWN
features_provided	HERMETICALLY SEALED AND ULTRAVIOLET ERASABLE AND PROGRAMMABLE AND LOW POWER
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC AND GLASS
memory_device_type	ROM
storage_temp_range	-65.0 TO 125.0 CELSIUS DEGC
operating_temp_range	+0.0 TO 70.0 CELSIUS DEGC
input_circuit_pattern	13 INPUT
peripheral_shape_style	ROUND
NSN	5962-01-162-3899

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 13 INPUT

•

INCLOSURE MATERIAL: CERAMIC AND GLASS

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.515 INCHES MINIMUM AND 0.600 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN

•

FEATURES PROVIDED: HERMETICALLY SEALED AND ULTRAVIOLET ERASABLE AND PROGRAMMABLE AND LOW POWER

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

MEMORY DEVICE TYPE: ROM

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	13 INPUT
INCLOSURE MATERIAL	CERAMIC AND GLASS
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.515 INCHES MINIMUM AND 0.600 INCHES MAXIMUM IN
BODY HEIGHT	0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN
FEATURES PROVIDED	HERMETICALLY SEALED AND ULTRAVIOLET ERASABLE AND PROGRAMMABLE AND LOW POWER
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	ROM
BODY LENGTH	1.235 INCHES MINIMUM AND 1.285 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-65.0 TO 125.0 CELSIUS DEGC

SUBSTITUTES & CROSS-REFERENCES 1

2716Reference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — mutilation + specific procedure

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FREQUENTLY ASKED QUESTIONS

What is 10800003?

10800003 is a MICROCIRCUIT,MEMORY.

What parts can replace 10800003?

There is 1 known substitute for 10800003: 2716. Substitute compatibility should be verified for your specific system.

What is the NSN for 10800003?

10800003 is cataloged in the U.S. Government catalog under NSN 5962-01-162-3899. This indicates validated use in U.S. government and defense supply chains.

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10800003 — MICROCIRCUIT,MEMORY

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