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10664750 — SEMICONDUCTOR DEVICE,DIODE

✓ Government record, cited
— · SFP TRANSCEIVER
PRODUCT OVERVIEW

10664750: SEMICONDUCTOR DEVICE,DIODE.

The SEMICONDUCTOR DEVICE,DIODE is a the manufacturer industrial component. Key specifications include material: GLASS ENCLOSURE, overall_length: 0.766 INCHES MINIMUM AND 0.792 INCHES MAXIMUM IN, mounting_method: PRESS FIT, overall_diameter: 0.222 INCHES MINIMUM AND 0.240 INCHES MAXIMUM IN, terminal_type_and_quantity: 2 FERRULE, function_for_which_designed: MICROWAVE AND MIXER. This part is cataloged in the U.S.

Government catalog under NSN 5961-00-014-7062, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
10664750
NSN: 5961-00-014-7062
FSC: 5961 — Semiconductor Devices and Associated Hardware
CAGE: 18876 — US ARMY AVIATION AND MISSILE COMMAND (USA)
SPECIFICATIONS
materialGLASS ENCLOSURE
overall_length0.766 INCHES MINIMUM AND 0.792 INCHES MAXIMUM IN
mounting_methodPRESS FIT
overall_diameter0.222 INCHES MINIMUM AND 0.240 INCHES MAXIMUM IN
terminal_type_and_quantity2 FERRULE
function_for_which_designedMICROWAVE AND MIXER
maximum_operating_temp_per_measurement_point150.0 CELSIUS AMBIENT AIR DEGC
NSN5961-00-014-7062
COMPONENT DIAGRAM
BAIL LATCH 10G SFP+ 850nm · SR (MMF, 300m) DOM: Digital Optical Monitoring TX RX LC DUPLEX 20-PIN EDGE CONNECTOR ~56.5 mm ~13.4mm SFP+ TRANSCEIVER | 10G | 850nm | SR (MMF, 300m) Hot-swappable | LC duplex fiber | DDM/DOM supported TITLE SFP+ XCVR PN 10664750 MFR OEM SEMICONDUCTOR DEVICE,DIODE
KEY FEATURES
•
MAXIMUM OPERATING TEMP PER MEASUREMENT POINT: 150.0 CELSIUS AMBIENT AIR DEGC
•
OVERALL DIAMETER: 0.222 INCHES MINIMUM AND 0.240 INCHES MAXIMUM IN
•
MOUNTING METHOD: PRESS FIT
•
FUNCTION FOR WHICH DESIGNED: MICROWAVE AND MIXER
•
MATERIAL: SILICON SEMICONDUCTOR
•
TERMINAL TYPE AND QUANTITY: 2 FERRULE
TECHNICAL CHARACTERISTICS
MAXIMUM OPERATING TEMP PER MEASUREMENT POINT150.0 CELSIUS AMBIENT AIR DEGC
OVERALL DIAMETER0.222 INCHES MINIMUM AND 0.240 INCHES MAXIMUM IN
MOUNTING METHODPRESS FIT
OVERALL LENGTH0.766 INCHES MINIMUM AND 0.792 INCHES MAXIMUM IN
FUNCTION FOR WHICH DESIGNEDMICROWAVE AND MIXER
MATERIALSILICON SEMICONDUCTOR
MATERIALGLASS ENCLOSURE
TERMINAL TYPE AND QUANTITY2 FERRULE
OTHER ITEMS IN FSC 5961 — Semiconductor Devices and Associated Hardware
Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.
5961-00-000-0150 5961-00-000-4541 5961-00-000-5400 5961-00-000-7614 5961-00-000-8760 5961-00-001-1352 5961-00-001-2624 5961-00-001-2978
SUBSTITUTES & CROSS-REFERENCES 1
1N23GReference document
Same NSN cross-reference
Reference document — Design control — primary reference
LIFECYCLE
NSN statusActive· U.S. Government catalog
Acquisition advice: Normally procured from the manufacturer (OEM)No demilitarization required
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FREQUENTLY ASKED QUESTIONS
What is 10664750?
10664750 is a SEMICONDUCTOR DEVICE,DIODE.
What parts can replace 10664750?
There is 1 known substitute for 10664750: 1N23G. Substitute compatibility should be verified for your specific system.
What is the NSN for 10664750?
10664750 is cataloged in the U.S. Government catalog under NSN 5961-00-014-7062. This indicates validated use in U.S. government and defense supply chains.
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