1051710-1 — MICROCIRCUIT,HYBRID

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

1051710-1: MICROCIRCUIT,HYBRID.

The MICROCIRCUIT,HYBRID is a the manufacturer industrial component. Key specifications include body_width: 2.380 INCHES MAXIMUM IN, body_height: 0.161 INCHES MAXIMUM IN, body_length: 2.380 INCHES MAXIMUM IN, special_features: 12 MBIT BULK MEMORY, features_provided: DYNAMIC AND ELECTROSTATIC SENSITIVE, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-416-6489, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

1051710-1

NSN: 5962-01-416-6489
FSC: 5962 — Microcircuits, Electronic
CAGE: 96214 — RAYTHEON COMPANY DBA RAYTHEON (USA)

SPECIFICATIONS

body_width	2.380 INCHES MAXIMUM IN
body_height	0.161 INCHES MAXIMUM IN
body_length	2.380 INCHES MAXIMUM IN
special_features	12 MBIT BULK MEMORY
features_provided	DYNAMIC AND ELECTROSTATIC SENSITIVE
output_logic_form	COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC
storage_temp_range	-65.0 TO 15.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 110.0 CELSIUS DEGC
hybrid_technology_type	MONOLITHIC
inclosure_configuration	LEADED CHIP CARRIER
NSN	5962-01-416-6489

COMPONENT DIAGRAM

KEY FEATURES

•

HYBRID TECHNOLOGY TYPE: MONOLITHIC

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

DESIGN FUNCTION AND QUANTITY: 1 MEMORY, RANDOM ACCESS

•

BODY WIDTH: 2.380 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.161 INCHES MAXIMUM IN

•

FEATURES PROVIDED: DYNAMIC AND ELECTROSTATIC SENSITIVE

•

INCLOSURE CONFIGURATION: LEADED CHIP CARRIER

TECHNICAL CHARACTERISTICS

HYBRID TECHNOLOGY TYPE	MONOLITHIC
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
DESIGN FUNCTION AND QUANTITY	1 MEMORY, RANDOM ACCESS
BODY WIDTH	2.380 INCHES MAXIMUM IN
BODY HEIGHT	0.161 INCHES MAXIMUM IN
FEATURES PROVIDED	DYNAMIC AND ELECTROSTATIC SENSITIVE
INCLOSURE CONFIGURATION	LEADED CHIP CARRIER
SPECIFICATION/STANDARD DATA	82577-656250-002 MANUFACTURERS SOURCE CONTROL
BODY LENGTH	2.380 INCHES MAXIMUM IN

OTHER ITEMS IN FSC 5962 — Microcircuits, Electronic

Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.

5962-00-001-1861 5962-00-001-1901 5962-00-001-1902 5962-00-001-1905 5962-00-001-1906 5962-00-001-1907 5962-00-001-1908 5962-00-001-1909

SUBSTITUTES & CROSS-REFERENCES 2

656250-002Same NSN cross-reference

Same NSN cross-reference

Also cataloged under this NSN

1119196-1Same NSN cross-reference

Same NSN cross-reference

Also cataloged under this NSN

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Terminal item — stock exhausted; no further procurementDemilitarization required — mutilation + specific procedure

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FREQUENTLY ASKED QUESTIONS

What is 1051710-1?

1051710-1 is a MICROCIRCUIT,HYBRID.

What parts can replace 1051710-1?

There are 2 known substitutes for 1051710-1: 656250-002, 1119196-1. Substitute compatibility should be verified for your specific system.

What is the NSN for 1051710-1?

1051710-1 is cataloged in the U.S. Government catalog under NSN 5962-01-416-6489. This indicates validated use in U.S. government and defense supply chains.

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1051710-1 — MICROCIRCUIT,HYBRID

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