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10359553 — MICROCIRCUIT,MEMORY

✓ Government record, cited
— · COMPONENT
PRODUCT OVERVIEW

10359553: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 1.180 INCHES MAXIMUM IN, body_height: 0.345 INCHES MAXIMUM IN, body_length: 1.180 INCHES MAXIMUM IN, features_provided: BURN IN AND MONOLITHIC AND STATIC OPERATION, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, precious_material: GOLD. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-332-9945, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
10359553
NSN: 5962-01-332-9945
FSC: 5962 — Microcircuits, Electronic
CAGE: A486G — NIMIKKEISTOKESKUS NCB FINLAND (FIN)
SPECIFICATIONS
body_width1.180 INCHES MAXIMUM IN
body_height0.345 INCHES MAXIMUM IN
body_length1.180 INCHES MAXIMUM IN
features_providedBURN IN AND MONOLITHIC AND STATIC OPERATION
output_logic_formCOMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
precious_materialGOLD
inclosure_materialCERAMIC
memory_device_typeRAM
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
test_data_document96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
inclosure_configurationLEADLESS FLAT PACK
NSN5962-01-332-9945
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN 10359553 MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
INCLOSURE MATERIAL: CERAMIC
•
TERMINAL SURFACE TREATMENT: GOLD
•
PRECIOUS MATERIAL: GOLD
•
BODY WIDTH: 1.180 INCHES MAXIMUM IN
•
BODY HEIGHT: 0.345 INCHES MAXIMUM IN
•
FEATURES PROVIDED: BURN IN AND MONOLITHIC AND STATIC OPERATION
•
INCLOSURE CONFIGURATION: LEADLESS FLAT PACK
•
MEMORY DEVICE TYPE: RAM
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS
INCLOSURE MATERIALCERAMIC
TERMINAL SURFACE TREATMENTGOLD
PRECIOUS MATERIALGOLD
BODY WIDTH1.180 INCHES MAXIMUM IN
BODY HEIGHT0.345 INCHES MAXIMUM IN
FEATURES PROVIDEDBURN IN AND MONOLITHIC AND STATIC OPERATION
INCLOSURE CONFIGURATIONLEADLESS FLAT PACK
MEMORY DEVICE TYPERAM
BODY LENGTH1.180 INCHES MAXIMUM IN
STORAGE TEMP RANGE-65.0 TO 150.0 CELSIUS DEGC
SUBSTITUTES & CROSS-REFERENCES 5
IDT7133S90GBReference document
Same NSN cross-reference
Reference document — Secondary reference
5962-8861001ZCSame NSN cross-reference
Same NSN cross-reference
Also cataloged under this NSN
5962-88610Reference document
Same NSN cross-reference
Reference document — Identification reference
5962-8861001BZCReference document
Same NSN cross-reference
Reference document — Secondary reference
5962-8861001ZXReference document
Same NSN cross-reference
Reference document — Advisory reference — outside the item-of-supply concept
LIFECYCLE
NSN statusActive· U.S. Government catalog
Acquisition advice: Terminal item — no further procurement; issued until stock is exhaustedDemilitarization required — critical (Q)
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FREQUENTLY ASKED QUESTIONS
What is 10359553?
10359553 is a MICROCIRCUIT,MEMORY.
What parts can replace 10359553?
There are 5 known substitutes for 10359553: IDT7133S90GB, 5962-8861001ZC, 5962-88610 and 2 more. Substitute compatibility should be verified for your specific system.
What is the NSN for 10359553?
10359553 is cataloged in the U.S. Government catalog under NSN 5962-01-332-9945. This indicates validated use in U.S. government and defense supply chains.
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