1035-5617 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

1035-5617: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.495 INCHES MINIMUM AND 0.600 INCHES MAXIMUM IN, body_height: 0.090 INCHES MINIMUM AND 0.155 INCHES MAXIMUM IN, body_length: 1.180 INCHES MINIMUM AND 1.290 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND MONOLITHIC AND PROGRAMMABLE AND BIPOLAR, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC AND GLASS. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-157-9907, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

1035-5617

NSN: 5962-01-157-9907
FSC: 5962 — Microcircuits, Electronic
CAGE: 50027 — UNDERSEA SENSOR SYSTEMS INC DIV ULTRA SONOBUOY SYSTEMS (USA)

SPECIFICATIONS

body_width	0.495 INCHES MINIMUM AND 0.600 INCHES MAXIMUM IN
body_height	0.090 INCHES MINIMUM AND 0.155 INCHES MAXIMUM IN
body_length	1.180 INCHES MINIMUM AND 1.290 INCHES MAXIMUM IN
features_provided	HERMETICALLY SEALED AND MONOLITHIC AND PROGRAMMABLE AND BIPOLAR
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC AND GLASS
memory_device_type	PROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	13 INPUT
inclosure_configuration	DUAL-IN-LINE
NSN	5962-01-157-9907

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 13 INPUT

•

INCLOSURE MATERIAL: CERAMIC AND GLASS

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.495 INCHES MINIMUM AND 0.600 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.090 INCHES MINIMUM AND 0.155 INCHES MAXIMUM IN

•

FEATURES PROVIDED: HERMETICALLY SEALED AND MONOLITHIC AND PROGRAMMABLE AND BIPOLAR

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

MEMORY DEVICE TYPE: PROM

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	13 INPUT
INCLOSURE MATERIAL	CERAMIC AND GLASS
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.495 INCHES MINIMUM AND 0.600 INCHES MAXIMUM IN
BODY HEIGHT	0.090 INCHES MINIMUM AND 0.155 INCHES MAXIMUM IN
FEATURES PROVIDED	HERMETICALLY SEALED AND MONOLITHIC AND PROGRAMMABLE AND BIPOLAR
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	PROM
BODY LENGTH	1.180 INCHES MINIMUM AND 1.290 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC

SUBSTITUTES & CROSS-REFERENCES 1

9999-3352-001Reference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is 1035-5617?

1035-5617 is a MICROCIRCUIT,MEMORY.

What parts can replace 1035-5617?

There is 1 known substitute for 1035-5617: 9999-3352-001. Substitute compatibility should be verified for your specific system.

What is the NSN for 1035-5617?

1035-5617 is cataloged in the U.S. Government catalog under NSN 5962-01-157-9907. This indicates validated use in U.S. government and defense supply chains.

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1035-5617 — MICROCIRCUIT,MEMORY

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