10241100547 — MICROCIRCUIT,DIGITAL

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

10241100547: MICROCIRCUIT,DIGITAL.

The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.470 INCHES MINIMUM AND 0.490 INCHES MAXIMUM IN, body_height: 0.080 INCHES MINIMUM AND 0.120 INCHES MAXIMUM IN, body_length: 0.580 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN, memory_capacity: UNKNOWN, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC AND GLASS. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-074-1813, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

10241100547

NSN: 5962-01-074-1813
FSC: 5962 — Microcircuits, Electronic
CAGE: 89944 — ELBITAMERICA, INC. (USA)

SPECIFICATIONS

body_width	0.470 INCHES MINIMUM AND 0.490 INCHES MAXIMUM IN
body_height	0.080 INCHES MINIMUM AND 0.120 INCHES MAXIMUM IN
body_length	0.580 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN
memory_capacity	UNKNOWN
features_provided	HERMETICALLY SEALED AND MONOLITHIC AND W/DECODED OUTPUT AND W/ENABLE AND W/STROBE AND 3-STATE OUTPUT AND DELAY, D-TYPE AND NEGATIVE OUTPUTS AND POSITIVE OUTPUTS AND W/STORAGE
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC AND GLASS
memory_device_type	ROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	8 INPUT
inclosure_configuration	DUAL-IN-LINE
NSN	5962-01-074-1813

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 8 INPUT

•

INCLOSURE MATERIAL: CERAMIC AND GLASS

•

TERMINAL SURFACE TREATMENT: SOLDER

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BODY WIDTH: 0.470 INCHES MINIMUM AND 0.490 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.080 INCHES MINIMUM AND 0.120 INCHES MAXIMUM IN

•

FEATURES PROVIDED: HERMETICALLY SEALED AND MONOLITHIC AND W/DECODED OUTPUT AND W/ENABLE AND W/STROBE AND 3-STATE OUTPUT AND DELAY, D-TYPE AND NEGATIVE OUTPUTS AND POSITIVE OUTPUTS AND W/STORAGE

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

MEMORY DEVICE TYPE: ROM

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	8 INPUT
INCLOSURE MATERIAL	CERAMIC AND GLASS
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.470 INCHES MINIMUM AND 0.490 INCHES MAXIMUM IN
BODY HEIGHT	0.080 INCHES MINIMUM AND 0.120 INCHES MAXIMUM IN
FEATURES PROVIDED	HERMETICALLY SEALED AND MONOLITHIC AND W/DECODED OUTPUT AND W/ENABLE AND W/STROBE AND 3-STATE OUTPUT AND DELAY, D-TYPE AND NEGATIVE OUTPUTS AND POSITIVE OUTPUTS AND W/STORAGE
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	ROM
BODY LENGTH	0.580 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC

SUBSTITUTES & CROSS-REFERENCES 5

KL8204IReference document

Same NSN cross-reference