102336G1: SEMICONDUCTOR DEVICE ASSEMBLY.
The SEMICONDUCTOR DEVICE ASSEMBLY is a the manufacturer industrial component. Key specifications include overall_width: 2.000 INCHES NOMINAL IN, overall_height: 0.138 INCHES NOMINAL IN, overall_length: 6.500 INCHES NOMINAL IN, mounting_configuration: SIX 0.125 IN.DIA.UNTHD MTG HOLES IN. This part is cataloged in the U.S.
Government catalog under NSN 5961-01-072-6189, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| overall_width | 2.000 INCHES NOMINAL IN |
| overall_height | 0.138 INCHES NOMINAL IN |
| overall_length | 6.500 INCHES NOMINAL IN |
| mounting_configuration | SIX 0.125 IN.DIA.UNTHD MTG HOLES IN |
| NSN | 5961-01-072-6189 |
| OVERALL HEIGHT | 0.138 INCHES NOMINAL IN |
| MAJOR COMPONENTS | DIODE 44,PRINTED WIRING BOARD 1 |
| OVERALL LENGTH | 6.500 INCHES NOMINAL IN |
| OVERALL WIDTH | 2.000 INCHES NOMINAL IN |
| MOUNTING CONFIGURATION | SIX 0.125 IN.DIA.UNTHD MTG HOLES IN |
No substitute or cross-reference records for this part.