102260G1: SEMICONDUCTOR DEVICE ASSEMBLY.
The SEMICONDUCTOR DEVICE ASSEMBLY is a the manufacturer industrial component. Key specifications include overall_width: 2.000 INCHES NOMINAL IN, overall_height: 0.137 INCHES NOMINAL IN, overall_length: 4.000 INCHES NOMINAL IN, mounting_configuration: FOUR 0.125 IN.DIA.UNTHD HOLES ON 3.500 IN.BY 1.500 IN.MTG CENTERS IN. This part is cataloged in the U.S.
Government catalog under NSN 5961-01-072-6187, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| overall_width | 2.000 INCHES NOMINAL IN |
| overall_height | 0.137 INCHES NOMINAL IN |
| overall_length | 4.000 INCHES NOMINAL IN |
| mounting_configuration | FOUR 0.125 IN.DIA.UNTHD HOLES ON 3.500 IN.BY 1.500 IN.MTG CENTERS IN |
| NSN | 5961-01-072-6187 |
| OVERALL HEIGHT | 0.137 INCHES NOMINAL IN |
| MAJOR COMPONENTS | DIODE 19,PRINTED WIRING BOARD 1 |
| OVERALL LENGTH | 4.000 INCHES NOMINAL IN |
| OVERALL WIDTH | 2.000 INCHES NOMINAL IN |
| MOUNTING CONFIGURATION | FOUR 0.125 IN.DIA.UNTHD HOLES ON 3.500 IN.BY 1.500 IN.MTG CENTERS IN |
No substitute or cross-reference records for this part.