1017B9019-1 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

1017B9019-1: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.364 INCHES MINIMUM AND 0.380 INCHES MAXIMUM IN, body_height: 0.190 INCHES MAXIMUM IN, body_length: 1.060 INCHES MINIMUM AND 1.090 INCHES MAXIMUM IN, special_features: ELECTROSTATIC DISCHARGE SENSITIVE, features_provided: BIPOLAR AND MONOLITHIC AND HERMETICALLY SEALED AND 3-STATE OUTPUT, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-079-4835, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

1017B9019-1

NSN: 5962-01-079-4835
FSC: 5962 — Microcircuits, Electronic
CAGE: 78022 — NORTHROP GRUMMAN SYSTEMS CORPORATION (USA)

SPECIFICATIONS

body_width	0.364 INCHES MINIMUM AND 0.380 INCHES MAXIMUM IN
body_height	0.190 INCHES MAXIMUM IN
body_length	1.060 INCHES MINIMUM AND 1.090 INCHES MAXIMUM IN
special_features	ELECTROSTATIC DISCHARGE SENSITIVE
features_provided	BIPOLAR AND MONOLITHIC AND HERMETICALLY SEALED AND 3-STATE OUTPUT
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	RAM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	16 INPUT
end_item_identification	AN/APN-218
NSN	5962-01-079-4835

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 16 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.364 INCHES MINIMUM AND 0.380 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.190 INCHES MAXIMUM IN

•

CRITICALITY CODE JUSTIFICATION: FEAT

•

FEATURES PROVIDED: BIPOLAR AND MONOLITHIC AND HERMETICALLY SEALED AND 3-STATE OUTPUT

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	16 INPUT
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.364 INCHES MINIMUM AND 0.380 INCHES MAXIMUM IN
BODY HEIGHT	0.190 INCHES MAXIMUM IN
CRITICALITY CODE JUSTIFICATION	FEAT
FEATURES PROVIDED	BIPOLAR AND MONOLITHIC AND HERMETICALLY SEALED AND 3-STATE OUTPUT
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	RAM
BODY LENGTH	1.060 INCHES MINIMUM AND 1.090 INCHES MAXIMUM IN

SUBSTITUTES & CROSS-REFERENCES

No substitute or cross-reference records for this part.

LIFECYCLE

NSN statusActive· U.S. Government catalog

Demilitarization required — mutilation

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FREQUENTLY ASKED QUESTIONS

What is 1017B9019-1?

1017B9019-1 is a MICROCIRCUIT,MEMORY.

What is the NSN for 1017B9019-1?

1017B9019-1 is cataloged in the U.S. Government catalog under NSN 5962-01-079-4835. This indicates validated use in U.S. government and defense supply chains.

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1017B9019-1 — MICROCIRCUIT,MEMORY

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