The SEMICONDUCTOR DEVICE,DIODE is a the manufacturer industrial component. Key specifications include material: SILICON SEMICONDUCTOR, overall_width: 3.250 INCHES NOMINAL IN, overall_length: 0.160 INCHES MINIMUM AND 0.205 INCHES MAXIMUM IN, mounting_method: TERMINAL, terminal_length: 1.100 INCHES MINIMUM IN, overall_diameter: 0.080 INCHES MINIMUM AND 0.107 INCHES MAXIMUM IN. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 6695-00-043-3977, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| material | SILICON SEMICONDUCTOR |
| overall_width | 3.250 INCHES NOMINAL IN |
| overall_length | 0.160 INCHES MINIMUM AND 0.205 INCHES MAXIMUM IN |
| mounting_method | TERMINAL |
| terminal_length | 1.100 INCHES MINIMUM IN |
| overall_diameter | 0.080 INCHES MINIMUM AND 0.107 INCHES MAXIMUM IN |
| special_features | WEAPON SYSTEM ESSENTIAL |
| features_provided | HERMETICALLY SEALED CASE |
| overall_thickness | 0.525 INCHES NOMINAL IN |
| surface_treatment | SILVER |
| dial_aperture_size | 3.000 IN. DIA IN |
| mounting_hole_size | 0.170 IN. DIA IN |
| NSN | 6695-00-043-3977 |
| OVERALL LENGTH | 3.250 INCHES NOMINAL IN |
| DIAL APERTURE KNOB CUTOUT FEATURE | NOT INCLUDED |
| DIAL APERTURE SIZE | 3.000 IN. DIA IN |
| INSTRUMENT SIZE FOR WHICH DESIGNED | 3 IN. DIA IN |
| MOUNTING HOLE SIZE | 0.170 IN. DIA IN |
| MOUNTING METHOD | BY HOLES IN FLANGE |
| OVERALL THICKNESS | 0.525 INCHES NOMINAL IN |
| SURFACE TREATMENT | SILVER |
| MATERIAL | ALUMINUM ALLOY |
| MOUNTING HOLE CONFIGURATION | ON 2.474 IN. BY 2.474 IN. IN |