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10133902 — MICROCIRCUIT,DIGITAL

✓ Government record, cited
— · COMPONENT
PRODUCT OVERVIEW

10133902: MICROCIRCUIT,DIGITAL.

The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include features_provided: BURN IN AND ELECTROSTATIC SENSITIVE AND PROGRAMMED, inclosure_material: CERAMIC, memory_device_type: PAL, storage_temp_range: -65.0 TO 150.0 CELSIUS DEGC, operating_temp_range: -55.0 TO 125.0 CELSIUS DEGC, inclosure_configuration: LEADLESS FLAT PACK. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-340-0200, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
10133902
NSN: 5962-01-340-0200
NIINs: 013400200, 015190500
FSC: 5962 — Microcircuits, Electronic
CAGE: A486G — NIMIKKEISTOKESKUS NCB FINLAND (FIN)
SPECIFICATIONS
features_providedBURN IN AND ELECTROSTATIC SENSITIVE AND PROGRAMMED
inclosure_materialCERAMIC
memory_device_typePAL
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
inclosure_configurationLEADLESS FLAT PACK
terminal_surface_treatmentSOLDER
terminal_type_and_quantity20 LEADLESS
voltage_rating_and_type_per_characteristic7.0 VOLTS MAXIMUM POWER SOURCE
NSN5962-01-340-0200
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,DIGITAL TITLE COMPONENT PN 10133902 MFR MICROCIRCUIT,DIGITAL
KEY FEATURES
•
INCLOSURE MATERIAL: CERAMIC
•
TERMINAL SURFACE TREATMENT: SOLDER
•
FEATURES PROVIDED: BURN IN AND ELECTROSTATIC SENSITIVE AND PROGRAMMED
•
INCLOSURE CONFIGURATION: LEADLESS FLAT PACK
•
MEMORY DEVICE TYPE: PAL
•
STORAGE TEMP RANGE: -65.0 TO 150.0 CELSIUS DEGC
•
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 7.0 VOLTS MAXIMUM POWER SOURCE
•
OPERATING TEMP RANGE: -55.0 TO 125.0 CELSIUS DEGC
TECHNICAL CHARACTERISTICS
INCLOSURE MATERIALCERAMIC
TERMINAL SURFACE TREATMENTSOLDER
FEATURES PROVIDEDBURN IN AND ELECTROSTATIC SENSITIVE AND PROGRAMMED
INCLOSURE CONFIGURATIONLEADLESS FLAT PACK
MEMORY DEVICE TYPEPAL
STORAGE TEMP RANGE-65.0 TO 150.0 CELSIUS DEGC
VOLTAGE RATING AND TYPE PER CHARACTERISTIC7.0 VOLTS MAXIMUM POWER SOURCE
OPERATING TEMP RANGE-55.0 TO 125.0 CELSIUS DEGC
TERMINAL TYPE AND QUANTITY20 LEADLESS
SUBSTITUTES & CROSS-REFERENCES 2
ROM/PROMReference document
Same NSN cross-reference
Reference document — Secondary reference
8507006-116Reference document
Same NSN cross-reference
Reference document — Secondary reference
LIFECYCLE
NSN statusActive· U.S. Government catalog
Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)
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FREQUENTLY ASKED QUESTIONS
What is 10133902?
10133902 is a MICROCIRCUIT,DIGITAL.
What parts can replace 10133902?
There are 2 known substitutes for 10133902: ROM/PROM, 8507006-116. Substitute compatibility should be verified for your specific system.
What is the NSN for 10133902?
10133902 is cataloged in the U.S. Government catalog under NSN 5962-01-340-0200. This indicates validated use in U.S. government and defense supply chains.
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